2012 International Electron Devices Meeting 2012
DOI: 10.1109/iedm.2012.6479042
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A highly integrated 65-nm SoC process with enhanced power/performance of digital and analog circuits

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Cited by 17 publications
(5 citation statements)
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“…The deeply depleted channel (DDC) MOS transistor has recently been announced by SuVolta as a competitor to FinFET and UTB-SOI MOS transistor, for its several advantages. These are reduced random dopant fluctuation (RDF) effect because of the use of lightly doped channel [2]- [3], increased carrier mobility due to reduced scattering of the carriers in the channel. In addition, as the DDC MOS transistor is based on the existing bulk CMOS technology with little modifications, the layout IPs of the bulk MOS transistors can be used for them.…”
Section: Introductionmentioning
confidence: 97%
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“…The deeply depleted channel (DDC) MOS transistor has recently been announced by SuVolta as a competitor to FinFET and UTB-SOI MOS transistor, for its several advantages. These are reduced random dopant fluctuation (RDF) effect because of the use of lightly doped channel [2]- [3], increased carrier mobility due to reduced scattering of the carriers in the channel. In addition, as the DDC MOS transistor is based on the existing bulk CMOS technology with little modifications, the layout IPs of the bulk MOS transistors can be used for them.…”
Section: Introductionmentioning
confidence: 97%
“…In addition, as the DDC MOS transistor is based on the existing bulk CMOS technology with little modifications, the layout IPs of the bulk MOS transistors can be used for them. The DDC MOS transistor is implemented in 65nm process technology and reported in [3] - [6].…”
Section: Introductionmentioning
confidence: 99%
“…We considered an external voltage source for the body biasing. However, similar biasing can be generated with minimal area overhead [37]. Recall that ULL DDC devices are optimized to reduce the leakage current while maintaining sufficient I ON .…”
Section: Resultsmentioning
confidence: 99%
“…The authors in [35] addressed the limitation of voltage scaling in bulk-CMOS by using extremely thin Silicon-On-Insulator SOI (ETSOI) for low-power applications. The ETSOI [35] and Tri-gate FET [36] structures with selectively grown epitaxial channels after shallow trench isolation (STI) improve performance but do not address V T variation due to RDF [37,38]. None of these technological advancements allow a 6T SRAM to operate in the subthreshold region or address subthreshold challenges stated in [2] and [24].…”
Section: Technology Considerationmentioning
confidence: 99%
“…Unlike dopant changes, an increase in the impurities makes RDF worse and increases junction leakage [78]. A DDC technology for 65nm [79][78] is designed to optimize the trade-off between V th variation and sub-threshold leakage. This paper describes new ULL devices in a 55nm DDC technology that target total leakage current reduction with RBB.…”
Section: Ddc Technologymentioning
confidence: 99%