2014
DOI: 10.1038/srep05358
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A High-yield Two-step Transfer Printing Method for Large-scale Fabrication of Organic Single-crystal Devices on Arbitrary Substrates

Abstract: Single-crystal organic nanostructures show promising applications in flexible and stretchable electronics, while their applications are impeded by the large incompatibility with the well-developed photolithography techniques. Here we report a novel two-step transfer printing (TTP) method for the construction of organic nanowires (NWs) based devices onto arbitrary substrates. Copper phthalocyanine (CuPc) NWs are first transfer-printed from the growth substrate to the desired receiver substrate by contact-printi… Show more

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Cited by 27 publications
(14 citation statements)
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“…4 For next-generation flexible electronics, it is strongly desired to develop highly flexible circuit components, which can be bent, twisted, rolled, and stretched. 1-3 Novel devices such as bendable and foldable display, conformable sensor, biomedical electronics, and other flexible electronic applications have been demonstrated and they have been achieved by utilizing mechanically flexible electronic components.…”
Section: Introductionmentioning
confidence: 99%
“…4 For next-generation flexible electronics, it is strongly desired to develop highly flexible circuit components, which can be bent, twisted, rolled, and stretched. 1-3 Novel devices such as bendable and foldable display, conformable sensor, biomedical electronics, and other flexible electronic applications have been demonstrated and they have been achieved by utilizing mechanically flexible electronic components.…”
Section: Introductionmentioning
confidence: 99%
“…[7] The strategies for fabrication of conductive patterns on flexible substrates include the use of printable conductive inks and the deposition process which uses for deposition using different techniques such as screen printing, contact printing, and transfer printing. [8, 9] Among these technologies, printing conductive inks has drawn significant attention for fabrication of complex two-dimensional (2D) or three-dimensional (3D) flexible electronics owing to its robustness, cost effectiveness, and the high resolution of emerging commercial printers. [10, 11] In contrast to other microfabrication technologies that mostly result in planar structures, printing allow the fabrication of complex electrical circuits in a 3D manner.…”
mentioning
confidence: 99%
“…. Transconductance data for CuPc‐based FETs are scarcely available, but the cr‐PVA/PEDOT:PSS/CuPc devices show values at least one order of magnitude better than those previously reported . Another point to be noted, is that the gate leakage current is in general lower in cr‐PVA/PEDOT:PSS/CuPc devices than in devices with PEDOT:PSS absence, also constituting an advantage of the treatment.…”
Section: Resultsmentioning
confidence: 81%