A high-precision Mark positioning algorithm based on sub-pixel shape template matching in wafer bonding alignment

Wang, Rui; Kai-ming, Yang; Zhu, Yan

doi:10.1016/j.precisioneng.2022.11.016

Cited by 8 publications

(3 citation statements)

References 14 publications

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“…, plug them into formula (1), take partial derivatives of dx and dy respectively, and set the derivatives to zero, it can be concluded that [13]:…”

Section: Image Recognition Of Photovoltaic Cell Occlusion Based On Su...mentioning

confidence: 99%

Image Recognition of Photovoltaic Cell Occlusion Based on Subpixel Matching

Jin,

Yu,

Yin

et al. 2024

EAI Endorsed Trans Energy Web

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INTRODUCTION: During the operation of large photovoltaic power stations, they are often shielded by dust and bird droppings, which greatly reduce the power generation and even cause fires. Analysis of PV cell occlusion image recognition accuracy based on sub-pixel matching. OBJECTIVES: In order to find the location of the pv cells, we use the method of subpixel image matching. Improve recognition accuracy. METHODS: When the power plant is running normally, taken the original image for photovoltaic power station as the original sample, and then using the subpixel gradient matching algorithm, to match the original image and find out that the minimum matching values. RESULTS: If the calculation results is greater than a specified threshold, When the calculated result is greater than the specified threshold, the power station is considered abnormal. CONCLUSION: The experimental process shows that this method can better judge the operating status of photovoltaic power station, and can find out the location of mismatched photovoltaic cells more accurately, and the calculation accuracy reaches sub-pixel level.

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“…, plug them into formula (1), take partial derivatives of dx and dy respectively, and set the derivatives to zero, it can be concluded that [13]:…”

Section: Image Recognition Of Photovoltaic Cell Occlusion Based On Su...mentioning

confidence: 99%

Image Recognition of Photovoltaic Cell Occlusion Based on Subpixel Matching

Jin,

Yu,

Yin

et al. 2024

EAI Endorsed Trans Energy Web

View full text Add to dashboard Cite

show abstract

“…[1] However, traditional robots programmed through teach-in methods can only perform repetitive operations at fixed positions. [2] Although this method of depalletization is fast, it lacks flexibility and accuracy, which becomes evident when faced with complex environments. [3] In recent years, researchers have integrated sensors into teach-in programmed robots for detection purposes to enhance their precision.…”

Section: Introductionmentioning

confidence: 99%

Design and implementation of robot depalletizing system based on 3D vision

Guo,

Jing,

2024

Fourth International Conference on Sensors and Information Technology (ICSI 2024)

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In response to the limitations of traditional industrial robots, which can only perform fixed-point palletizing tasks with low actual gripping accuracy and high failure rates, a 3D vision-based robot palletizing system was designed. This system focuses on the pallets containing workpieces and installs the camera in a manner similar to having eyes in the hands. To improve the robot's gripping accuracy, the Shape-NCC (Normalized Cross-Correlation) rotation-invariant template matching algorithm is used to identify target images, overcoming the problem of the traditional NCC algorithm being unable to find targets after image rotation. Using depth images, the system obtains the three-dimensional coordinates and rotation angles of the pallets in the target images, and communicates this position information to the robot via TCP. The robot then adjusts its grip position based on this information and ultimately completes the palletizing task automatically according to the palletizing strategy. Field experiments demonstrate that the system can achieve highprecision palletizing, with position errors within ±5mm and angle errors within ±1.7°. When operating at the highest speed in automatic mode, the palletizing speed reaches 70%, meeting the precision and speed requirements of industrial palletizing systems.

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“…In addition, increasing the demand for enhanced positioning accuracy during the wafer bonding processes in three-dimensional (3D) stacked packages has become a prominent concern. [32,33] Current positioning tools for multilayer wafer bonding predominantly rely on optical microscopes. In response to this challenge, we are exploring the replacement of existing interlayer positioning packaging materials with luminescent materials to achieve superior positioning accuracy through fluorescence microscopy.…”

Section: Introductionmentioning

confidence: 99%

Low‐temperature‐curable and photo‐patternable benzocyclobutene‐derived aggregation‐induced emission‐active polymer dielectrics

Yuan,

Xie,

Qian

et al. 2024

Aggregate

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The high curing temperatures required for traditional benzocyclobutene (BCB) materials have posed limitations on their applicability in high‐temperature‐sensitive fields. To address this challenge, our work focuses on the synthesis of a novel tetraphenylethylene (TPE)‐functionalized BCB monomer, TPE–BCB, achieved through the introduction of an ether bond onto the BCB's four‐membered ring via Williamson reaction. TPE–BCB demonstrates remarkable low‐temperature curing properties, characterized by a ring‐opening peak temperature of 190°C, representing a reduction of 60°C compared to conventional BCBs. Fully cured TPE–BCB resins exhibit exceptional dielectric and mechanical properties, coupled with minimal water absorption. Additionally, the incorporation of TPE with aggregation‐induced emission characteristics enhances the resins’ luminescence and photolithographic capabilities. Notably, our TPE–BCB resins achieve impressive photolithography performance with a resolution ratio of up to 10 μm. In contrast to conventional BCB‐functionalized resins, TPE–BCB offers the dual advantage of low‐temperature curing and luminescence. This development marks a significant step in the advancement of low‐temperature curing BCB materials and serves as a pioneering example in the realm of multilayer wafer bonding materials.

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A high-precision Mark positioning algorithm based on sub-pixel shape template matching in wafer bonding alignment

Cited by 8 publications

References 14 publications

Image Recognition of Photovoltaic Cell Occlusion Based on Subpixel Matching

Image Recognition of Photovoltaic Cell Occlusion Based on Subpixel Matching

Design and implementation of robot depalletizing system based on 3D vision

Low‐temperature‐curable and photo‐patternable benzocyclobutene‐derived aggregation‐induced emission‐active polymer dielectrics

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