Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2013 2013
DOI: 10.1364/ofc.2013.otu3h.2
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A High End Routing Platform for Core and Edge Applications Based on Chip To Chip Optical Interconnect

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Cited by 35 publications
(10 citation statements)
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“…Fig. 1(b) shows the respective OPCB layout produced by the OptoBoard-Sim when considering an optoelectronic (O/E) router with a total number of 88 bi-directional I/O links with every link operating at 8Gbps, following a realistic scenario of using only the two outer I/O rows of an O/E router with 12x14 optical I/O's matrix [4] over a dual-layer embedded polymer waveguide PCB [2]. In this arrangement, the first outer-row 48 peripheral I/O pins of the O/E router's I/O matrix connect to the first PCB waveguide layer and the second-periphery row 40 I/O pins connect to the second waveguide layer.…”
Section: Optical Blade Versus Cray Xk7 Card Performance Analysismentioning
confidence: 99%
See 1 more Smart Citation
“…Fig. 1(b) shows the respective OPCB layout produced by the OptoBoard-Sim when considering an optoelectronic (O/E) router with a total number of 88 bi-directional I/O links with every link operating at 8Gbps, following a realistic scenario of using only the two outer I/O rows of an O/E router with 12x14 optical I/O's matrix [4] over a dual-layer embedded polymer waveguide PCB [2]. In this arrangement, the first outer-row 48 peripheral I/O pins of the O/E router's I/O matrix connect to the first PCB waveguide layer and the second-periphery row 40 I/O pins connect to the second waveguide layer.…”
Section: Optical Blade Versus Cray Xk7 Card Performance Analysismentioning
confidence: 99%
“…Optical Printed Circuit Boards (OPCBs) are researched towards replacing electrical PCB interconnects and low-loss embedded polymer waveguide interconnects have been demonstrated to yield Tb/s on-board transmission capabilities [3]. In all this deployment, communication is realized with optical I/O's to an ASIC electronic router chip [2] that can even reach 168 bi-directional links [4]. However, all these impressive technology advances can be translated into system-scale benefits only when evaluated through a design and performance toolkit, similar with the simulation platform for optical networks on chip presented in [5].…”
Section: Introductionmentioning
confidence: 99%
“…3D stacking ICs offers the most compact packaging for optical transceivers possible [8]. The different solution for connecting the 3D stacked ICs differ in their complexity and performance.…”
Section: A Rf Performance Comparisonmentioning
confidence: 99%
“…Electrooptical circuit board (EOCB) and mid-board optical transceiver subassemblies (optical engines) will be the two key enabling elements of this migration. In first step very low-loss optical fiber shuffles can be easily combined with electrical PCBs but with higher optical circuit complexity [4] including multiple optical layers planar waveguide technologies are required which will be embedded as inner PCB layer with up to eight or more optical layers and waveguide pitch of 125 µm or below [5]. A common implementation would be an optical backplane with MTP compliant interfaces, which can be connected directly or via pluggable board-to-board interfaces to the optical engine on a peripheral linecard as schematically shown in Fig.…”
Section: Introductionmentioning
confidence: 99%