GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996
DOI: 10.1109/gaas.1996.567874
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A high efficiency 0.15 μm 2-mil thick InGaAs/AlGaAs/GaAs V-band power HEMT MMIC

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Cited by 21 publications
(3 citation statements)
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“…Secondly, the thinner substrate decreases the thermal resistance of the devices, thus resulting in a lower channel operating temperature. More detailed advantages of 2-mil thick via holes as compared to 4-mil thick via holes in GaAs power amplifiers was reported elsewhere [11].…”
Section: 15 µM Gaas Phemt Mmic Technologymentioning
confidence: 99%
“…Secondly, the thinner substrate decreases the thermal resistance of the devices, thus resulting in a lower channel operating temperature. More detailed advantages of 2-mil thick via holes as compared to 4-mil thick via holes in GaAs power amplifiers was reported elsewhere [11].…”
Section: 15 µM Gaas Phemt Mmic Technologymentioning
confidence: 99%
“…A power amplifier with superior performance is needed as a key device in the systems for small size, low weight, and low cost. There are many reports for V-band power amplifiers [2][3][4][5][6][7][8]. They aim to achieve higher power, efficiency, and power gain mainly.…”
Section: Introductionmentioning
confidence: 99%
“…When we combine multiple device cells to provide a large output power, the effects of the reduced source inductance will become more pronounced. The use of multiple via holes can also significantly reduce the thermal resistance of the devices [11]. The InGaAs/AlGaAs/GaAs PHEMTs used in this study were fabricated by TRANSCOM, Inc.…”
Section: Introductionmentioning
confidence: 99%