A Heat Pipe Cooler for High Power LED’s Cooling in Harsh Conditions

Sosoi, Gavril; Vizitiu, Robert Ștefan; Burlacu, Andrei; Gălățanu, Cătălin Daniel

doi:10.1016/j.promfg.2019.02.247

Cited by 9 publications

(5 citation statements)

References 19 publications

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“…The total pressure drop for each flow section (inlet pipe, block channel, and outlet pipe) can be calculated as stated in Equations (25) and (26) by using Equations (17), (18), (21) and 24:…”

Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

“…Nevertheless, extended surfaces heat sinks are usually insufficient to provide enough cooling rates for the high-power LEDs. Other less common thermal management methods such as microjet cold plates [13,14], thermoelectric refrigeration [15], liquid metal cooling of cold plates [16], porous media micro cooling blocks [17], heat pipe applications [18], ferrofluid coolant [19], electric field control [20], and monolayer applications [21] have been published in the current literature. Liquid cooling blocks present an effective cooling alternative for the LED's cooling as well as other cooling applications on electronic devices, batteries, etc.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Kılıç

Aktaş²,

Sevilgen

2020

Energies

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This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjugate heat transfer in solid and fluid domains was used. Laminar flow was considered in the present analysis. The validation of the numerical model was realized by using the measured data from the test rig. It was observed that substantial temperature variations were occurred around the LED chip owing to volumetric heat generation. The cooling board with lower height performs better thermal performance but higher pressure drop for the same mass flow rates. The cooling board with the finned cover plate performs better thermal performance but results in an increased pressure drop for the same mass flow rates. Increasing the power of the LED results in higher temperature values for the same mass flow rates. The junction temperature is highly dependent on the mass flow rates and LED power. It can be controlled by means of the mass flow rate of the coolant fluid. New Nusselt number correlations are proposed for laminar flow mini-channel liquid cooling block applications.

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Section: Friction Coefficient and Pressure Drop Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Kılıç

Aktaş²,

Sevilgen

2020

Energies

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“…They investigated the heat transfer properties of the heat pipe with two condensers. Sosoi et al [20] designed a cylindrical heat pipe to cool high-power LEDs and numerically analyzed it for certain conditions. They assessed the resulting junction temperatures.…”

Section: Introduction (Gi̇ri̇ş)mentioning

confidence: 99%

Isı Emici-Isı Borulu İnovatif Bir Yüksek Güçlü LED Termal Yönetim Sisteminin Deneysel ve Nümerik Analizi

ÇİÇEK,

ÜRÜN,

ŞAHİN

2023

Gazi Üniversitesi Fen Bilimleri Dergisi Part C: Tasarım Ve Teknoloji

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The efficiency and lifespan of light emitting diodes (LEDs) are adversely affected by the junction temperature. Therefore, it is very important to operate a LED at a low junction temperature. In this study, it is aimed to minimize the junction temperature of high power LEDs so that reliability and light output of the device can be maximized. In the study, a heat pipe-heat sink cooler was designed for the high power LEDs. The study was carried out experimentally and the results obtained from the experimental study were also verified numerically in the ANSYS Fluent software. Total power inputs ranging between 40 W and 100 W were applied to the LEDs and the performance of the cooler in the current design was examined. To observe the effect of the heat pipe on the LED junction temperature, a heat sink without heat pipe was designed and analyzed both experimentally and numerically. The results show that, the heat sink with fin is sufficient at low LED input powers, while at high LED input powers, the heat pipe-heat sink provides much more effective cooling. At the same time, the effect of different thermal interface materials on LED junction temperature was observed, by using with materials with thermal conductivities of 1.8 W/m.K, 8.5 W/m.K and 11 W/m.K, for each power input. As the coefficient of thermal conductivity of the thermal interface materials increased, the temperature of the LED solder point decreased.

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“…Flat plate heat pipes (FPHP) are widely used in the field of thermal applications. 1–3 The heat dissipation of a heating element is still a challenge, for which the heat generation is increasing with technological development. The method of forced air circulation for cooling and heat dissipation cannot meet the requirements of heating elements with high heat flux.…”

Section: Introductionmentioning

confidence: 99%

A visualization study on flat plate heat pipe (FPHP)

Wan

Gao

Wang

et al. 2021

Proceedings of the Institution of Mechanical Engineers, Part A:

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With the aim to analyze the flow pattern and heat transfer characteristics of the working fluid in a flat plate heat pipe (FPHP) which was sealed by a transparent tempered glass plate, ethanol, acetone, and R141b were taken as the working medium, and visual experiments were performed at different heat flux when the inclination angle was 90°. The vapor-liquid distribution and the heat transfer characteristics of the FPHP were investigated at different liquid filling ratios. According to the experimental results and the recording of high-speed cameras, some important conclusions had been drawn as follows: (i) As the power increases, the vapor-liquid interface in the FPHP declines and the effects of dryout is significantly intnsified, leading to a sharp increase in temperature. The FPHP with a filling ratios of 25.7% owns better thermal performance than that with the filling ratios of 11.8% and 66% at different heating power; (ii) the bubble generation inside the FPHP became more intense with increasing heat flux, and various bubble movement patterns were found at different the liquid filling ratios; (iii) As the liquid film flowed downward, the thickness of the liquid film increased at first and then decreases. The condensation of steam was reduced due to the thickening of the liquid film on the wall. The liquid film became thinner when it was entrapped and evaporated in the downward flow.

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A Heat Pipe Cooler for High Power LED’s Cooling in Harsh Conditions

Cited by 9 publications

References 19 publications

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Thermal Assessment of Laminar Flow Liquid Cooling Blocks for LED Circuit Boards Used in Automotive Headlight Assemblies

Isı Emici-Isı Borulu İnovatif Bir Yüksek Güçlü LED Termal Yönetim Sisteminin Deneysel ve Nümerik Analizi

A visualization study on flat plate heat pipe (FPHP)

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