Optical Fiber Communication Conference 2012
DOI: 10.1364/ofc.2012.om3e.3
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A Generic Foundry Model for InP-based Photonic ICs

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Cited by 39 publications
(26 citation statements)
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“…A 2 × 2 port subfabric comprises four MZIs, strong passive waveguides, a waveguide crossing, and eight short SOAs (with transition elements as described below). This has the further advantage of being compatible with a generic InP design and fabrication approach, such as that implemented within the PARADIGM project [33], thereby addressing issues of cost and manufacturability. Table I lists the loss of different components used.…”
Section: B Building Block Approachmentioning
confidence: 99%
“…A 2 × 2 port subfabric comprises four MZIs, strong passive waveguides, a waveguide crossing, and eight short SOAs (with transition elements as described below). This has the further advantage of being compatible with a generic InP design and fabrication approach, such as that implemented within the PARADIGM project [33], thereby addressing issues of cost and manufacturability. Table I lists the loss of different components used.…”
Section: B Building Block Approachmentioning
confidence: 99%
“…One the main goal for photonic researchers is the monolithic integration of the laser and the modulator on a single chip and then to compact these components. More than two decades, the opto-electronic (OE) researchers are focused on implementing optical devices using InP/InGaAsP materials provides the capability of monolithic integration of different active and passive components [1].…”
Section: Introductionmentioning
confidence: 99%
“…Such a process is called a generic integration process and this platform approach has also been applied recently in photonics where the analogous basic building blocks of the photonic circuit become units for gain, phase control, and polarization control (Figure 1 (b)). The generic foundry model for photonics 4,5 offers both access to new users and the potential for exploitation outside of telecoms in a wide variety of applications, at a development cost which is shared and therefore considerably lower. In Europe, generic technology platforms for photonic integration are being created for the fabrication of photonic integrated circuits (PICs); in Silicon 6 , in passive dielectrics 7 such as TriPleX TM , and in Indium Phosphide 8 , Generic platform technology for InP based photonics has recently taken the first steps towards commercialisation through the brokering organisation JePPIX 9 .…”
Section: Introductionmentioning
confidence: 99%