Annual Reliability and Maintainability Symposium 1995 Proceedings
DOI: 10.1109/rams.1995.513238
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A framework for reliability modeling of electronics

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Cited by 11 publications
(3 citation statements)
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“…The physics-of-failure approach is implemented in Computer Aided Design of Microelectronics Packages (CADMP) [36], [37] software. CADMP, developed by CALCE, can improve assessment of component reliability at the design phase, the development of science-based tests, assessment of packages designed by different manufacturers, and cost-effective product development.…”
Section: B Physics-of-failure Modelmentioning
confidence: 99%
“…The physics-of-failure approach is implemented in Computer Aided Design of Microelectronics Packages (CADMP) [36], [37] software. CADMP, developed by CALCE, can improve assessment of component reliability at the design phase, the development of science-based tests, assessment of packages designed by different manufacturers, and cost-effective product development.…”
Section: B Physics-of-failure Modelmentioning
confidence: 99%
“…A notable discrepancy exists in the literature between the definitions of failure mode and failure mechanism. In some publications, the physical processes that lead to failure are termed failure mechanisms, and the effects of those failure mechanisms are termed failure modes [1,2,12,15]. In spite of these plausible definitions of failure mechanism and failure mode, the widely accepted Failure Modes and Effects Analysis (FMEA) involves the investigation and assessment of the effects of possible failure modes on a system, and the effects of electrical failure modes are identified as shorts and open circuits [6].…”
Section: Failure Modementioning
confidence: 99%
“…Alpha particle induced soft errors [15,17,21] occur when a sufficient number of the minority carriers generated by an alpha particle or a cosmic ray are collected on a storage node to pull the node from logic high to logic low thereby destroying the memory state. Alpha particles can be produced by cosmic rays or the radioactive decay of uranium and thorium impurities incorporated in IC packaging materials.…”
Section: Failure Modes Identified As a Form Of Noisementioning
confidence: 99%