A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

Liu, Wei-Te; Yang, Chih Kai; Chiu, Tz-Cheng; Chen, Dao-Long; Hsiao, Ching-Lin; Tarng, David

doi:10.1109/ectc32696.2021.00140

Cited by 10 publications

(1 citation statement)

References 9 publications

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“…The latter exhibits a high thermal expansion, whereas the thermal expansion of the former is very low, and that of Cu ranges between them. Thermal stress is generated in the Cu wires by the different coefficients of the silicon, Cu, and epoxy molding compound during the thermal cycling tests 19 , 20 . Recently, the size of Cu wires in semiconductor chips has been reduced to the nanoscale, and their excellent mechanical properties have become increasingly important 21 – 23 .…”

Section: Introductionmentioning

confidence: 99%

Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration

Kao

Shen

et al. 2023

Sci Rep

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Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, Cu foils fabricated through electroplating with various bis-(3-sulfopropyl) disulfide (SPS) concentrations are examined using tensile tests. The SPS concentration affects the grain size of the electroplated Cu foils, resulting in different mechanical properties. A significant Hall–Petch effect, $${\sigma }_{y} = 197.4 + 0.12{d}^{\frac{-1}{2}}$$ σ y = 197.4 + 0.12 d - 1 2 , is demonstrated for the electroplated Cu foils. The different concentrations of impurities identified through time-of-flight secondary ion mass spectrometry correspond to the different grain sizes, determining the transgranular and intergranular fracture during the tensile test. The results demonstrate that the SPS concentration controlling the microstructures of the electroplated Cu results in a Hall–Petch effect on the mechanical properties of the electroplated Cu foils.

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