Abstract:The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry can achieve a soldered bonding to LED chips. The flexible layers of polyethylene terephthalate (PET)-copper foil a… Show more
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