2016
DOI: 10.1007/s11554-016-0628-5
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A flexible mixed-signal image processing pipeline using 3D chip stacks

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“…It is our pleasure to introduce these articles in the following briefly. The first article with the title ''A flexible mixed-signal image processing pipeline using 3D chip stacks'' by Shi et al [16] proposes three-dimensional chip stacking suitable for smart camera applications. Here, an entire image processing pipeline consisting of a CMOS image sensor, analog preprocessing, analog/digital conversion, and digital processing can be combined in one chip stack.…”
Section: Heterogeneous Real-time Image Processingmentioning
confidence: 99%
“…It is our pleasure to introduce these articles in the following briefly. The first article with the title ''A flexible mixed-signal image processing pipeline using 3D chip stacks'' by Shi et al [16] proposes three-dimensional chip stacking suitable for smart camera applications. Here, an entire image processing pipeline consisting of a CMOS image sensor, analog preprocessing, analog/digital conversion, and digital processing can be combined in one chip stack.…”
Section: Heterogeneous Real-time Image Processingmentioning
confidence: 99%