Area-selective atomic layer deposition (AS-ALD) is a
bottom-up
fabrication technique that may revolutionize the semiconductor manufacturing
process. Because the efficiency and applicability of AS-ALD strongly
depend on the properties of the molecular precursors for deposition,
the structural design and optimization of the precursors are strongly
needed. With the aid of various modern computational chemistry tools,
tailor-made molecular design of the ALD precursors for high deposition
selectivity may become possible. In this Perspective, the requirements
and challenges for the molecular properties of the AS-ALD precursors,
as well as the theoretical design strategies for them, are discussed.
Current approaches for the theoretical analysis and design of the
AS-ALD processes and materials are reviewed. A possible simulation
strategy for the various aspects of ALD and AS-ALD precursors is suggested.