A finite element-domain decomposition coupled resistance extraction method with virtual terminal insertion

Yang, Bo; Murata, Hiroshi

doi:10.1109/mwscas.2007.4488812

Cited by 4 publications

(1 citation statement)

References 4 publications

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“…A 3-D direct BEM (DBEM) was utilized that produced highly accurate results on a typical 52-contact substrate structure as shown in [3]. 3-D FEM-based techniques were also shown to provide accurate predictions in real designs [4], [5] and complex geometries including the modeling of PCB and package ground/power metallization planes for resistance extraction [6].…”

Section: Introductionmentioning

confidence: 99%

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Doğruöz¹,

Shankaran

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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A printed circuit board (PCB) consists of multiple layers of dielectric material and current-carrying metal traces and vias. Performing system-level simulations of PCBs with detailed trace and via geometries is very costly, the present approach considers the effects of the trace and via geometry in the physical model by importing Electronic Computer Aided Design (ECAD) data comprising the trace and via layout of the board and determines spatially varying orthotropic conductivity (k x , k y , and k z ) on the PCB based on the ECAD data. In addition, the present approach considers the effects of joule heating in the current-carrying traces by utilizing multiple 2-D sources where the powermap is determined by solving the governing dc electric field equations on the trace. In this paper, the effects of both the trace layer orthotropic thermal conductivity and joule heating are studied on a sample PCB. Comparisons are made with earlier studies and conventional models when possible. It is shown that the location of the hot spots and temperature values differ substantially if different methods are used.

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Section: Introductionmentioning

confidence: 99%

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Doğruöz¹,

Shankaran

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards

Shankaran

Doğruöz

deAraujo

2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

Doğruöz

2016

Journal of Electronic Packaging

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A printed circuit board (PCB) comprises a solid piece of dielectric material with embedded layers of current carrying metal traces and vias. Geometric features of these metal traces and vias in modern PCBs are highly nonuniform and complicated such that the card level or system level numerical simulations by using the actual trace and via geometries are computationally expensive. The present study investigates the effects of Joule heating in current carrying traces on the temperature distribution of PCBs by conducting one-way and two-way direct current (DC) electric and computational fluid dynamics (CFD) simulations. DC electric field simulations are performed to determine the power map of trace layers which are modeled as planar heat generating sources by using the temperature-dependent electrical conductivity of the metal trace. The power distribution varies with the implemented size and power thresholds. Thermal conductivity map of the PCB is determined by using the electronic computer-aided design (ECAD) images of the individual layers. By using these planar source and thermal conductivity maps, CFD simulations are conducted to determine the resulting temperature distribution on the board. A methodology is developed and applied to a sample, complex PCB, and the generated results are compared with those of the previous studies and conventional models. The computational data show that the temperature distributions over the PCB and its mounted components experience large variations based on the implemented thermal conductivity mapping and the Joule heating modeling technique.

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A finite element-domain decomposition coupled resistance extraction method with virtual terminal insertion

Cited by 4 publications

References 4 publications

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

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