A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method

Wang, Hai; Wan, Jiachun; Tan, Sheldon X.-D.; Zhang, Chi; Tang, He; Yuan, Yuan; Huang, Keheng; Zhang, Zhenghong

doi:10.1109/tc.2017.2778066

Cited by 18 publications

(2 citation statements)

References 27 publications

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“…Designing appropriate thermal management policies requires a fast and accurate thermal simulator for quick evaluation, which has resulted in various thermal simulators such as 3D-ICE [50] and HotSpot [59] to emerge. Such thermal simulators [32,50,[52][53][54]59] use floorplan and power traces as inputs and generate temperature values as output. 3D-ICE [50] develops a thermal simulator and presents a transient thermal model with microchannel cooling for liquid-cooled ICs.…”

Section: Background and Related Workmentioning

confidence: 99%

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems

Siddhu¹,

Kedia²,

Pandey³

et al. 2021

Preprint

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Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation remains a significant problem for processors. Therefore, the thermal management of processors continues to be an active subject of research. Most thermal management research takes place using simulations, given the challenges involved in measuring temperatures in real processors. Fast yet accurate interval thermal simulation toolchains remain the research tool of choice to study thermal management in processors at system-level. However, since in most existing processors, core and memory are fabricated on separate packages, with the memory having lower power densities than the cores, thermal management research in processors primarily focused on the cores. Consequently, state-of-the-art interval thermal simulation toolchains remain limited to core-only simulations.The memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging technology places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. These new packagings significantly increase the power density of the processors, making them prone to overheating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors.To address this issue, we present CoMeT , the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high-and low-density processors corresponding to four different core-memory (integration) configurations -off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only an additional ∼5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.

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Section: Background and Related Workmentioning

confidence: 99%

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems

Siddhu¹,

Kedia²,

Pandey³

et al. 2021

Preprint

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“…High computational cost of a full non-linear thermal simulation has prompted the development of linearised techniques for the approximation of non-linearities in the thermal model, including the leakage power. In this context, a global linear approximation of the leakage current is proposed in [9], [10], a piecewise linear approximation (PWL) is considered in [11], [12], and a low-order polynomial approximation in [13]. In [11], the authors propose a continuous PWL approximation leakage current model used in thermal/leakage co-simulation.…”

Section: Introductionmentioning

confidence: 99%

Adaptive Transient Leakage-Aware Linearised Model for Thermal Analysis of 3-D ICs

Zhang

Mihajlović

Pavlidis

2019

2019 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Physics-based models for thermal simulation that involve numerical solution of the heat equation are well placed to accurately capture the heterogeneity of materials and structures in modern 3-D integrated circuits (ICs). The introduction of nonlinear effects such as leakage power significantly improves their accuracy. However, this non-linearity increases considerably the complexity and computational time of the analysis. In this paper, we introduce a linearised thermal model by demonstrating that the weak temperature dependence of the specific heat and the thermal conductivity of IC related materials has only minor effect to computed temperature profiles. Thus, these parameters can be considered constant for the operating temperature ranges of modern ICs. The non-linearity in leakage power is approximated by a piecewise linear least square fit and the resulting model is linearised by exact Newton's method. The method is applied to transient thermal analysis with adaptive time step selection, where we demonstrate the importance of applying Newton corrections to obtain the right time step size selection. The resulting method is typically 2 − 3× faster than a full non-linear method with a global relative error of less than 1%.

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