A facet-free 1.3-µm surface-emitting DFB laser for a low-cost optical module

Abstract

A facet-free surface-emitting distributed feed-back (DFB) laser is proposed for a low-cost optical module. A 45°mirror is integrated on front of a DFB laser for surface emission. Instead of a facet with a high-reflection (HR) coating, a distributed Bragg reflector mirror, a photodiode, and a window structure are integrated on its rear. It is experimentally confirmed this rear structure work same as the facet with the HR coating. The proposed facet-free laser demonstrated on-wafer measurement and attained high-reliability under high humidity. These results indicate the proposed laser can be manufactured cost-effectively without chip-level screenings and used in nonhermetic packages.

Tooling and procedures for hybrid integration of lasers by flip-chip technology

“…This can be implemented in a number of ways. For example, lasers can be mounted in a stand-a-lone module (complete with lens, isolator and mirror) for bonding and coupling to a grating [3,4], or an integrated structure with a lens that can be fabricated in the III-V gain material [5]. A more conventional technique is to bond a fabricated laser directly on to a PIC with the emission either grating-coupled This work was supported by the UK EPSRC Programme Grant, Silicon Photonics for Future Systems EP/L00044X/1 Fig.…”