A dynamic photoelastic study of stress-wave propagation through an inclusion

Determination of stress intensity factors for multi-material junctions

“…There are many experiments to investigate notch and crack behaviors because of obvious stress singularities in these problems, but still a few studies discussed simulation of the mechanical behavior near the junctions or inclusions in materials using experimental methods. Hemann et al (1976) first used photoelastic experiments to study the dynamic behavior of a plane pressure pulse propagating through an inclusion. Raiser and Clifton (1993) used a plate impact recovery experiment to identify the dominant failure mechanisms in ceramics, and the mechanical behavior due to the triple junctions of material was studied.…”