2010
DOI: 10.1007/s00542-010-1152-3
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A dry release of polyimide electrodes using Kapton film and application to EEG signal measurements

Abstract: We describe here a simple and novel method to fabricate polyimide (PI) electrodes without a complex process to release completed PI electrodes from the substrates after full-curing process. We separated the PI electrodes from the Si-wafer prior to full-curing process, and these non full-cured electrodes were placed between the Kapton films, and we performed full-curing process with these sandwiched electrodes. Then, PI electrodes were easily and clearly released from the substrate without the sacrificial layer… Show more

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Cited by 16 publications
(9 citation statements)
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“…The via-hole of the soft-baked first PI layer was fabricated by exposure to UV light (length: 365 nm, energy: 110 mJ cm −2 ) through a mask, followed by developing and rinsing processes. The first metal layer (Ti/Au = 30/100 nm thickness) was deposited using an e-beam evaporator, and the recording sites, interconnection pads and interconnection lines were patterned following reported wet metal etching processes [17]. Onto the metal patterns, the second PI layer was spin-coated, followed by soft-baking to passivate the metal line.…”
Section: Introductionmentioning
confidence: 99%
“…The via-hole of the soft-baked first PI layer was fabricated by exposure to UV light (length: 365 nm, energy: 110 mJ cm −2 ) through a mask, followed by developing and rinsing processes. The first metal layer (Ti/Au = 30/100 nm thickness) was deposited using an e-beam evaporator, and the recording sites, interconnection pads and interconnection lines were patterned following reported wet metal etching processes [17]. Onto the metal patterns, the second PI layer was spin-coated, followed by soft-baking to passivate the metal line.…”
Section: Introductionmentioning
confidence: 99%
“…p-NC was filled into the negative MPs and cured at 95 °C for 1 h to become a p-MP array (Figure a-i). The p-MP array was cut into a size of 1 × 3 mm 2 and sandwiched between the Au/Ti electrodes patterned on the PI substrate (thickness: Au, 100 nm; Ti, 20 nm; PI, 35 μm) to make the p-MP sensor (Figure a-ii,iii) . The p-MP sensor was then attached to a PTCA balloon catheter using Dymax.…”
Section: Resultsmentioning
confidence: 99%
“…Many research groups have proposed various mouse EEG electrodes positioned on diverse places to understand diverse signals according to brain activation. Such advanced methods like electrodes measuring intracranial EEG [ 2 , 12 , 13 , 14 , 15 ], surface field potential [ 16 ], epidural EEG [ 17 ], and epicranial EEG [ 3 , 18 , 19 , 20 , 21 , 22 ] have been proposed to be employed in mice. Many researchers conducted invasive EEG-related studies using laboratory animals with beneficial accessibility for surgical procedures regarding normal and disease models.…”
Section: Introductionmentioning
confidence: 99%