A Double-Sided Cooled Split-Phase SiC Power Module With Fuzz Button Interposer

Emon, Asif Imran; Wu, Yibo; Yang, Li; Mirza, Abdul Basit; Deng, Shiyue; Luo, Fang

doi:10.1109/jestpe.2023.3294932

Cited by 2 publications

(1 citation statement)

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“…Application of low CTE materials includes molybdenum buffer [4], porous sintered silver interposer [5] and die attach [6], etc. Examples of stress-relieving structures include trenched copper plates [7], geometrically modified spacers [3], Fuzzy buttons [8], and additional direct bonded copper plate (DBC) as stress relaxation [9], etc. This paper proposes a novel "floating die" as stressrelieving structure realized by liquid metal (LM) fluidic material.…”

Section: Introductionmentioning

confidence: 99%

Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging

Mu,

Janabi,

et al. 2024

IEEE Trans. Power Electron.

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Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electronic packages during operation. For wirebond-less SiC modules, the stress is even larger due to the structure's rigidity and the high Young's Modulus of SiC crystals. This paper takes a FPCB/die/AMB packaging stack as an example to prove the feasibility of floating die structure enabled by liquid metal (LM) fluidic connection. The CTE mismatch among the die, PCB and AMB substrate is decoupled by the LM layer without compromise of thermal and electrical conduction. Finite element analysis demonstrates a 56% reduction in von Mises stress of the device and more than 99% shear stress reduction at the FPCB-AMB interface, compared with a conventional rigid solder connection. Testing results show that LM-based packaging has similar thermal and electrical conduction and higher breakdown voltage when compared with the soldered counterpart. Accelerated thermal cycling aging tests validate the stability of the insulation ring for LM-based packaging, especially under high-temperature conditions. The feasibility of using LM fluidic interconnections for a floating die structure of SiC packaging is validated.

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