1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278)
DOI: 10.1109/isscc.1999.759104
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A DECT transceiver chip set using SiGe technology

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Cited by 18 publications
(5 citation statements)
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“…4 shows a block diagram of a PAM transmit modulation using a polar alternative in the form of direct amplitude and phase modulation. The direct phase modulation might be performed by modulating the oscillator tuning input in a feed-forward manner with Bopp [5] and B. Zhang [6]. The direct amplitude modulation might be performed by regulating the supply voltage to a constant-envelope power amplifier.…”
Section: Deep-submicron Integration Challengesmentioning
confidence: 99%
“…4 shows a block diagram of a PAM transmit modulation using a polar alternative in the form of direct amplitude and phase modulation. The direct phase modulation might be performed by modulating the oscillator tuning input in a feed-forward manner with Bopp [5] and B. Zhang [6]. The direct amplitude modulation might be performed by regulating the supply voltage to a constant-envelope power amplifier.…”
Section: Deep-submicron Integration Challengesmentioning
confidence: 99%
“…A two-point direct modulation scheme (such as in [5]) directly controls the oscillator frequency while compensating for the resulting loop reaction. This approach, however, is analog in nature and requires precise calibration of the oscillator and other PLL analog components.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, two-chip or three-chip solutions for 1.9-GHz digital European cordless telecommunications (DECT) applications have been presented based on various silicon-based technologies [1]- [3]. These chips need to be integrated with off-chip filters and discrete passive elements, such as chip inductors and capacitors, to build a complete RF transceiver module.…”
Section: Introductionmentioning
confidence: 99%