A Coupling Model for a Pair of Skewed Transmission Lines

Giri, D. V.; Chang, Shu‐Kong; Tesche, F. M.

doi:10.1109/temc.1980.303817

Cited by 18 publications

(4 citation statements)

References 2 publications

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“…Assuming that the unit tangential vector along the surface of conductor i approximately equals that of the vector along the conductor axis then (9) can be simplified to:…”

Section: Derivation Of the Mixed-potential Integral Equations (Mpie) mentioning

confidence: 99%

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High-Frequency Multiconductor Transmission-Line Theory

Nitsch

Tkachenko

2010

Found Phys

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This work presents a thorough derivation of the full-wave transmissionline equations on the basis of Maxwell's theory. The multiconductor system is assumed to be composed of nonuniform thin wires. It is shown that the mixed potential integral equations are equivalent to generalized telegrapher equations. Novel, exact, and compact expressions for the multiconductor transmission-line parameters are derived, and their connection to radiation effects is shown. Iteration and perturbation procedures are proposed for the solution of the generalized transmission-line equations.

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“…Assuming that the unit tangential vector along the surface of conductor i approximately equals that of the vector along the conductor axis then (9) can be simplified to:…”

Section: Derivation Of the Mixed-potential Integral Equations (Mpie) mentioning

confidence: 99%

“…Many works [6][7][8][9][10][11][12][13][14] are dedicated to the correction of the telegrapher equations when transmission lines with non-uniformities or discontinuities are under investigation. The models encompass abrupt bends, round bends, vertical risers and the cross coupling between two skewed lines.…”

mentioning

confidence: 99%

High-Frequency Multiconductor Transmission-Line Theory

Nitsch

Tkachenko

2010

Found Phys

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“…Although a thin dielectric spacer can be used to provide signal isolation between the crossing lines, for low noise sensor and readout applications at sub-Kelvin temperatures a vacuum dielectric is preferable for the bridge both from microwave circuit and electromagnetic performance perspectives. Such orthogonal circuit crossings can have minimal coupling due to the reduced interaction area and improved modal symmetry [3,4]. Compensation of the junction reactance can be employed to further improve upon the achievable match, isolation, and signal bandwidth [5].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Superconducting Vacuum-Gap Crossovers for High Performance Microwave Applications

Denis

Brown

Chang

et al. 2017

IEEE Trans. Appl. Supercond.

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The design and fabrication of low-loss widebandwidth superconducting vacuum-gap crossovers for high performance millimeter wave applications are described. In order to reduce ohmic and parasitic losses at millimeter wavelengths a vacuum gap is preferred relative to dielectric spacer. Here, vacuum-gap crossovers were realized by using a sacrificial polymer layer followed by niobium sputter deposition optimized for coating coverage over an underlying niobium signal layer. Both coplanar waveguide and microstrip crossover topologies have been explored in detail. The resulting fabrication process is compatible with a bulk micro-machining process for realizing waveguide coupled detectors, which includes sacrificial wax bonding, and wafer backside deep reactive ion etching for creation of leg isolated silicon membrane structures. Release of the vacuum gap structures along with the wax bonded wafer after DRIE is implemented in the same process step used to complete the detector fabrication.  Index Terms-Crossover, Air-Bridge, Microstrip and Co-Planar Waveguide transmission lines, MEMS, Superconducting circuit design and fabrication. MD 20771 USA

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“…Later, the emphasis shifted to coupling between crossing conductors on microstrip and microwave circuits where one or both conductors may carry incident currents. Giri et al [5] developed an equivalent circuit approximate model for the junction of two skewed transmission lines, where the inductive coupling was solved in close form and the capacitances obtained by solving coupled integral equations. In that paper the authors assumed TEM propagation on both conductors.…”

Section: Introductionmentioning

confidence: 99%