2018 IEEE International Electron Devices Meeting (IEDM) 2018
DOI: 10.1109/iedm.2018.8614652
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A cost-efficient 28nm split-gate eFLASH memory featuring a HKMG hybrid bit cell and HV device

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Cited by 10 publications
(4 citation statements)
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“…The SSI mechanism is investigated systematically by means of Synopsys Sentaurus technology computer-aided design (TCAD) simulations, varying the program conditions. All the numerical simulations have been performed fixing the values of the coupling gate voltage (V CG ), bit line voltage (V BL ) and erase gate voltage (V EG ) reported in literature [19][20][21][22][23] for the latest technology node, listed in Table 1 and shown in Figure 2. In particular, the bias conditions are: V CG = HV (>10 V) [19][20][21][22]; word line and commons source voltages (V WL and V CS , respectively) have been varied, respectively, in the range 0.7-1.1 V and 4-4.6 V [20,21,23]; V EG = V CS in order to avoid charge migration between the two electrodes [23]; I BL is fixed at~1 µA [20,24].…”
Section: Methodsmentioning
confidence: 99%
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“…The SSI mechanism is investigated systematically by means of Synopsys Sentaurus technology computer-aided design (TCAD) simulations, varying the program conditions. All the numerical simulations have been performed fixing the values of the coupling gate voltage (V CG ), bit line voltage (V BL ) and erase gate voltage (V EG ) reported in literature [19][20][21][22][23] for the latest technology node, listed in Table 1 and shown in Figure 2. In particular, the bias conditions are: V CG = HV (>10 V) [19][20][21][22]; word line and commons source voltages (V WL and V CS , respectively) have been varied, respectively, in the range 0.7-1.1 V and 4-4.6 V [20,21,23]; V EG = V CS in order to avoid charge migration between the two electrodes [23]; I BL is fixed at~1 µA [20,24].…”
Section: Methodsmentioning
confidence: 99%
“…In all the simulations, a single 1 s-long pulse is applied on all the electrodes. [19][20][21][22][23].…”
Section: Methodsmentioning
confidence: 99%
“…Previous work [ 27 ] proposed using a TiN/SiO 2 tunneling junction‐based resistor integrated in the back end of line (BEOL) and connected with FeFET drain, which is effective but difficult to implement. Another design involves using a split‐gate structure similar to split‐gate embedded FLASH memory, [ 28 ] where a conventional transistor is integrated in series with a FeFET, offering increased flexibility through gate‐tunable series resistance. However, this design complicates the integration processes.…”
Section: Proposal Of 1fefet Cammentioning
confidence: 99%
“…This approach, though effective, is inconvenient to implement. Another design is to adopt a split-gate structure, similar to the splitgate embedded FLASH memory [23], where a conven-…”
Section: Hfo Based Fefetmentioning
confidence: 99%