Proceedings of 2011 International Conference for High Performance Computing, Networking, Storage and Analysis 2011
DOI: 10.1145/2063384.2063412
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A 'cool' load balancer for parallel applications

Abstract: Meeting power requirements of huge exascale machines of the future would be one major challenge. Our focus in this paper is to minimize cooling power and we propose a technique, that uses a combination of DVFS and temperature aware load balancing to constrain core temperatures as well as save cooling energy. Our scheme is specifically designed to suit parallel applications which are typically tightly coupled. The temperature control comes at the cost of execution time and we try to minimize the timing penalty.… Show more

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Cited by 32 publications
(34 citation statements)
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“…It now supports features such as automatic checkpointing [52,40], communication optimizations [34], fault tolerance, and power-andtemperature optimizations [43].…”
Section: Charm++ and Cse Applicationsmentioning
confidence: 99%
“…It now supports features such as automatic checkpointing [52,40], communication optimizations [34], fault tolerance, and power-andtemperature optimizations [43].…”
Section: Charm++ and Cse Applicationsmentioning
confidence: 99%
“…Recently, Sarood et al [9] proposed models that take cooling energy consumptions into consideration. By reasonably balancing workloads and employing dynamic voltage and frequency scaling (DVFS), they successfully lowered the overall energy consumed by their cooling system while satisfying temperature constraints.…”
Section: A Single Data Centermentioning
confidence: 99%
“…Temperature-aware loading balancing strategies are investigated in [20] [21]. Taking into account energy conservation, the strategies limit CPU temperatures to a customized threshold.…”
Section: B Thermal-aware Resource Management Strategiesmentioning
confidence: 99%
“…The CPU factor has been addressed in prior studies (see, for example, [25] [20] [21]). Unfortunately, the thermal impact of disk I/O on data nodes remains an open issue.…”
Section: B Impact Of Cpu and Disks On Inlet/outlet Temperaturesmentioning
confidence: 99%