A control system for photolithographic sequences

Leang, S.; Ma, Shang-Yi; Thomson, James G.; Bombay, B.J.; Spanos, Costas J.

doi:10.1109/66.492813

Cited by 38 publications

(2 citation statements)

References 17 publications

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“…From equations (10) and (11), the relationships between the wafer and bake-plate steady-state temperatures, T w1 (∞), T w2 (∞), T p1 (∞) and T p2 (∞), are given as where…”

Section: Thermal Modellingmentioning

confidence: 99%

“…For every degree variation in wafer temperature uniformity during the baking process, CD can vary by as much as 20 nm [9]. A 9% variation in CD per 1 • C variation in temperature has been reported for a deep ultraviolet (DUV) resist [10]. Temperature uniformity control is thus an important issue in photoresist processing with stringent specifications [11].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

Hu¹,

Tay²,

Tsai³

2006

Meas. Sci. Technol.

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Wafer warpage can affect device performance, reliability and linewidth control in various processing steps in microelectronics manufacturing. Early detection will minimize cost and processing time. We have previously demonstrated an on-line approach for detecting wafer warpage and the profile of the warped wafer. The proposed approach demonstrates that the profile of the wafer can be computed during thermal processing steps in the lithography sequence. However, the approach is computationally intensive and information is made available at the end of the thermal processing step. Any attempts at real-time correction of the wafer temperature are thus not possible. In this paper, we proposed an in situ approach to detect wafer warpage and its profile midway through the thermal process. Based on first principles thermal modelling, we are able to detect and estimate the profile of a warped wafer from available temperature measurements. The proposed approach can be implemented on conventional thermal processing systems. Experimental results demonstrate the feasibility and repeatability of the approach. A 75% improvement in computational time is achieved with the proposed approach.

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“…From equations (10) and (11), the relationships between the wafer and bake-plate steady-state temperatures, T w1 (∞), T w2 (∞), T p1 (∞) and T p2 (∞), are given as where…”

Section: Thermal Modellingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

Hu¹,

Tay²,

Tsai³

2006

Meas. Sci. Technol.

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Traditional Ecological Knowledge of Resource Management in Nepal

Paudel

Sharma

Zhang

2022

Traditional Ecological Knowledge of Resource Management in Asia

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Development of MBPLS based control for serial operation processes

Chen

Tsai

2009

Korean J. Chem. Eng.

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A control scheme based on the multiblock PLS (MBPLS) model for multi-stage processes (or serially connected processes) is developed. MBPLS arranges a large number of variables into meaningful blocks for each stage of the large-scale system. Two control design strategies, course-to-course (CtC) and within-stage (WS) controls, are proposed for the re-optimization design in the whole multistage course. In CtC, MBPLS control and optimization are done by applying feedback from the finished output quality when one course for all stages is done. It utilizes the information from the current course to improve quality of the next one. In WS, the MBPLS-based re-optimization strategy is developed to explore the possible adjustments of the future inputs at the rest of the stages in order to fix up the disturbances just in time and to maintain the product specification when the current course is finished. The proposed technique is successfully applied to two simulated industrial problems, including a photolithography sequences and a reverse osmosis desalination process, and the advantages of the proposed method are demonstrated.

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A control system for photolithographic sequences

Cited by 38 publications

References 17 publications

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

Traditional Ecological Knowledge of Resource Management in Nepal

Development of MBPLS based control for serial operation processes

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