A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing

Mane, Sanjay Shrirang; Sethu, Raj Sekar; Bergmann, Lars; Erstling, Marco; Soon, Kok Heng

doi:10.1016/j.microrel.2019.06.025

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A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing

Cited by 3 publications

References 9 publications

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Elucidation of Metal Etching Defects Through the Experimental Design Process Characterization at Encapsulation and Electro-deflashing Processes

Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices

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