Hydrogenated amorphous
carbon thin films (a-C:H) have attracted
much attention because of their surprising properties, including ultralow
friction coefficients in specific conditions. Adhesion of a-C:H films
on ferrous alloys is poor due to chemical and physical aspects, avoiding
a widespread application of such a film. One possibility to overcome
this drawback is depositing an interlayeran intermediate thin
filmbetween the carbon-based coating and the substrate to
improve chemical interaction and adhesion. Based on this, interlayers
play a key role on a-C:H thin-film adhesion through a better chemical
network structure at the outermost layer of the a-SiC
x
:H interlayer, i.e., the a-C:H/a-SiC
x
:H interface. However, despite the latest important
advances on the subject, the coating adhesion continues being a cumbersome
problem since it depends on multifactorial causes. Thus, the purpose
of this paper is to report a standard protocol leading to surprising
good results based on the control of the interfacial chemical bonding
by properly biasing the substrate (between 500 and 800 V) during the
a-SiC
x
:H interlayer deposition at an appropriate
low temperature, by using hexamethyldisiloxane as precursor. The interlayers
and the outermost interfaces were analyzed by a comprehensive set
of techniques, including X-ray photoelectron spectroscopy, glow discharge
optical emission spectroscopy, and Fourier transform infrared spectroscopy.
Nanoscratch tests, complemented by scanning electron microscopy and
energy-dispersive X-ray spectroscopy, were used to evaluate the critical
load for delamination to certify and quantify the adhesion improvement.
This study was important to identify the chemical local bonding of
the elements at the interface and its local environment, including
the in-depth chemical composition profile of the coating. An important
effect is that the oxygen content decreases on increasing substrate
bias voltage, improving the adhesion of the film. This is due to the
fact that energetic ion hitting the growing interlayer breaks Si–O
and C–O bonds, augmenting the content of Si–C and C–C
bonds at the outermost interface of the a-SiC
x
:H interlayer and enhancing the a-C:H coating adhesion. Moreover,
the combination of high bias voltage (800 V) and low temperature (150
°C) during the a-SiC
x
:H interlayer
deposition allows good adhesion of a-C:H thin films due to sputtering
of light elements like oxygen. Therefore, an appropriated bias and
temperature combination can open new pathways in a-C:H thin-film deposition
at low temperatures. These results are particularly interesting for
temperature-sensible metal alloys, where well-adhered a-C:H thin films
are mandatory for tribological applications.