“…Thin films of wittichenite Cu 3 BiS 3 have been deposited by physical vapor deposition methods, including sputtering , and thermal evaporation, , but these methods are generally much more energy intensive and costly than solution processing . While Cu 3 BiS 3 thin films have been solution deposited with nonvacuum-based techniques, such as spray pyrolysis, , electrodeposition, , and chemical bath deposition, , solution deposition of Cu 3 BiS 3 thin films is still challenged by the need for presynthesized, noncommercially available precursors, extra postdeposition sulfurization steps, − amorphous films, low absorption coefficients (<10 5 cm –1 ), and/or films with high band gaps (>1.6 eV). , To overcome some of the general issues with solution processing of chalcogenides, our group reported a binary solvent mixture (termed an “alkahest”) comprised of thiols and amines that dissolves in excess of 100 different bulk materials, including metals, metal oxides, and metal chalcogenides, to form solution-processable semiconductor inks. − A simple dissolve and recover approach can be used to produce chalcogenide thin films through solution deposition and mild annealing. In the absence of an external chalcogen source, the thiol acts as a competent sulfur source to produce polycrystalline metal sulfides.…”