“…These techniques are generally used for the manufacturing of, for example, micropillars and microgrooves. [30][31][32][33] Electric discharge machining (EDM) was utilized to manufacture tungsten micropillars with a minimum diameter of 7 μm and an aspect ratio of 14 as well as microgrooves with a width of 142 μm in a 500 μm-thick tungsten plate. [34,35] Tungsten carbide was machined using EDM to manufacture micropillars with a minimum diameter of 3 μm and microholes with diameters of 60 μm in a 300 μm-thick tungsten carbide strip.…”
Tungsten is an important material for high‐temperature applications due to its high chemical and thermal stability. Its carbide, that is, tungsten carbide, is used in tool manufacturing because of its outstanding hardness and as a catalyst scaffold due to its morphology and large surface area. However, microstructuring, especially high‐resolution 3D microstructuring of both materials, is a complex and challenging process which suffers from slow speeds and requires expensive specialized equipment. Traditional subtractive machining methods, for example, milling, are often not feasible because of the hardness and brittleness of the materials. Commonly, tungsten and tungsten carbide are manufactured by powder metallurgy. However, these methods are very limited in the complexity and resolution of the produced components. Herein, tungsten ion‐containing organic–inorganic photoresins, which are patterned by two‐photon lithography (TPL) at micrometer resolution, are introduced. The printed structures are converted to tungsten or tungsten carbide by thermal debinding and reduction of the precursor or carbothermal reduction reaction, respectively. Using TPL, complex 3D tungsten and tungsten carbide structures are prepared with a resolution down to 2 and 7 μm, respectively. This new pathway of structuring tungsten and its carbide facilitates a broad range of applications from micromachining to metamaterials and catalysis.
“…These techniques are generally used for the manufacturing of, for example, micropillars and microgrooves. [30][31][32][33] Electric discharge machining (EDM) was utilized to manufacture tungsten micropillars with a minimum diameter of 7 μm and an aspect ratio of 14 as well as microgrooves with a width of 142 μm in a 500 μm-thick tungsten plate. [34,35] Tungsten carbide was machined using EDM to manufacture micropillars with a minimum diameter of 3 μm and microholes with diameters of 60 μm in a 300 μm-thick tungsten carbide strip.…”
Tungsten is an important material for high‐temperature applications due to its high chemical and thermal stability. Its carbide, that is, tungsten carbide, is used in tool manufacturing because of its outstanding hardness and as a catalyst scaffold due to its morphology and large surface area. However, microstructuring, especially high‐resolution 3D microstructuring of both materials, is a complex and challenging process which suffers from slow speeds and requires expensive specialized equipment. Traditional subtractive machining methods, for example, milling, are often not feasible because of the hardness and brittleness of the materials. Commonly, tungsten and tungsten carbide are manufactured by powder metallurgy. However, these methods are very limited in the complexity and resolution of the produced components. Herein, tungsten ion‐containing organic–inorganic photoresins, which are patterned by two‐photon lithography (TPL) at micrometer resolution, are introduced. The printed structures are converted to tungsten or tungsten carbide by thermal debinding and reduction of the precursor or carbothermal reduction reaction, respectively. Using TPL, complex 3D tungsten and tungsten carbide structures are prepared with a resolution down to 2 and 7 μm, respectively. This new pathway of structuring tungsten and its carbide facilitates a broad range of applications from micromachining to metamaterials and catalysis.
“…There are several techniques available for the fabrication of micro-shafts and similar parts. Micro-EDM has emerged as a leading technique because of its flexibility, economic viability, non-contact nature, and capacity to machine materials with high hardness, strength, and temperature resistance [8][9][10][11]. In particular, the wire electrical discharge grinding (WEDG) method proposed by Masuzawa et al [12] in 1985 makes micro-EDM more suitable for use in the high-precision machining of micro-shafts because of the lower energy transmitted via point discharge and wire electrode refreshment.…”
Micro-tools comprising difficult-to-machine materials have seen widespread application in micro-manufacturing to satisfy the demands of micro-part processing and micro-device development. Taking micro-shafts as an example, the related developmental technology, based on wire electric discharge grinding (WEDG) as the core method, is one of the key technologies used to prepare high-precision micro-shafts. To enable efficient and high-precision machining of micro-shafts with target diameters, instead of performing multiple repeated on-machine measurements and reprocessing, a geometric constraint strategy is proposed based on the previously introduced twin-mirroring-wire tangential feed electrical discharge grinding (TMTF-WEDG). This strategy encompasses the tool setting method, tangential feed distance compensation, and an equation that establishes the relationship between tangential distance and diameter variation. These components are derived from a key points analysis of the geometric constraints. The micro-shafts with diameters of 50 µm and consistencies of ±1.5 µm are repeatedly processed. A series of micro-shafts with diameters ranging from 30 µm to 120 µm achieve geometric constraints with a diameter accuracy of ±2 µm, accompanied by the complete continuous automation of the entire process. Accordingly, it can be concluded that the geometric constraint strategy is flexible and stable and can be controlled with high precision in the TMTF-WEDG process.
“…Research conducted so far on WEDM of the Inconel 718 alloy [ 43 , 44 , 45 ] has shown that many factors have an influence on the surface roughness and the material removal rate. Relatively few studies [ 46 , 47 , 48 ] have described the influence of the parameters of micro-WEDM on the surface topography’s properties. However, the influence of the discharge energy, the time interval, and the wire speed on the surface topography and the material removal rate after micro-WEDM of Inconel 718 has not been considered enough.…”
Precise machining of micro parts from difficult-to-cut materials requires using advanced technology such as wire electrical discharge machining (WEDM). In order to enhance the productivity of micro WEDM, the key role is understanding the influence of process parameters on the surface topography and the material’s removal rate (MRR). Furthermore, effective models which allow us to predict the influence of the parameters of micro-WEDM on the qualitative effects of the process are required. This paper influences the discharge energy, time interval, and wire speed on the surface topography’s properties, namely Sa, Sk, Spk, Svk, and MRR, after micro-WEDM of Inconel 718 were described. Developed RSM and ANN model of the micro-WEDM process, showing that the discharge energy had the main influence (over 70%) on the surface topography’s parameters. However, for MRR, the time interval was also significant. Furthermore, a reduction in wire speed can lead to a decrease in the cost process and have a positive influence on the environment and sustainability of the process. Evaluation of developed prediction models of micro-WEDM of Inconel 718 indicates that ANN had a lower value for the relative error compared with the RSM models and did not exceed 4%.
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