A comparison of typical additives for copper electroplating based on theoretical computation

Lai, Zhiqiang; Wang, Shouxu; Wang, Chong; Yan, Hong; Zhou, Guoyun; Chen, Yuanming; He, Wei; Peng, Yongqiang; Xiao, Dingjun

doi:10.1016/j.commatsci.2017.11.049

Cited by 62 publications

(37 citation statements)

References 32 publications

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“…As shown in Figure 7, E HOMO of PBDGE is −6.070 eV, which is near E HOMO of JGB (−5.689 eV). 18 E LUMO of PBDGE is −0.114 eV, which is much less than E LUMO of JGB (−3.635 eV). 18 These calculated energy levels support the fact that PBDGE is an effective leveler.…”

Section: ■ Results and Discussionmentioning

confidence: 79%

“…18 E LUMO of PBDGE is −0.114 eV, which is much less than E LUMO of JGB (−3.635 eV). 18 These calculated energy levels support the fact that PBDGE is an effective leveler. It is also observed in Figure 7 that the LUMO and HOMO of PBDGE molecules are mainly concentrated on the pyrrole ring of PBDGE, which implies that the pyrrole ring of PBDGE is in the active position of adsorption with the copper surface.…”

Section: ■ Results and Discussionmentioning

confidence: 79%

“…In the presence of Cl − , the accelerator has a strong adsorption effect on the copper surface. 18,19 It has been confirmed that SPS−Cl − is an accelerator for copper electrodeposition. 13−16 Zhu et al 20 found that SPS adsorption on copper surface is not related to the convection and ethylene oxide/propylene oxide (EO/PO) is proportional to convective intensity.…”

Section: ■ Introductionmentioning

confidence: 92%

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Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.

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Section: ■ Results and Discussionmentioning

confidence: 79%

Section: ■ Results and Discussionmentioning

confidence: 79%

Section: ■ Introductionmentioning

confidence: 92%

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Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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“…Currently, THs with various AR on one PCB is generally produced in manufacture where the plating equipment, plating parameters and electrolyte are basically invariant. For the exact AR, the synergistic effects of board thickness and diameter on THs plating are defined as the difficulty (D if ) (Lai et al, 2018;Tao et al, 2017;Chen et al, 2015;Chen et al, 2014). However, the requirements of uniformity are equally strict and critical for THs with various AR and different D if .…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating

Xiang

Wang

Chen

et al. 2019

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Purpose The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture. Design/methodology/approach The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds. Findings By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1. Originality/value The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.

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“…键的缘故[10] 。另外，从表 1 可知，有机添加剂的电负性值结果为 JGB>SPS>EO/PO，而电负性 χ 被认为是化学反应理论中分子的重要参数，是对分子整体电性质的度量。根据桑德森的电负性平衡理论[11] ：两种物质的电负性差异越小，两者越容易产生更快的吸附平衡。因此，可推测三种有机添加剂的反应活性从 JGB、SPS 到 EO/PO 依次降低，即 EO/PO 能更能持续稳定地存在于铜面。表 1 SPS、EO/PO、JGB 分子的 HOMO、LUMO 轨道能量 Table 1 HOMO and LUMO orbital energies of SPS, EO/PO, and JGB molecules…”

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Investigation of organic additives to regulate growth and signal transmission loss of copper interconnection structure

Chen

Zhang

et al. 2021

Sci. Sin.-Chim

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A comparison of typical additives for copper electroplating based on theoretical computation

Cited by 62 publications

References 32 publications

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating

Investigation of organic additives to regulate growth and signal transmission loss of copper interconnection structure

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