A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package

Mallampati, Sandeep; Baig, Zaeem; Pozder, Scott; Chua, Eng Chye

doi:10.1109/irps.2019.8720597

Cited by 3 publications

(1 citation statement)

References 7 publications

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“…Zhang et al [22] calculated theoretically and simulated the maximum shear stress of BGA based on engineering algorithm and finite element simulation. Mallampati et al [23] studied the risk of corner cracking using two substrate thickness and under-fill types in temperature cycling environment. Ma et al [24] investigated the effects of multiple reworks on the accelerated thermal cycling and shock per-formance of lead-free BGA assemblies.…”

Section: Introductionmentioning

confidence: 99%

Impact of ground solder ball failure in BGA package on near electric field radiation

Yuan

Zhang

Wang

et al. 2022

IEICE Electron. Express

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In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

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Section: Introductionmentioning

confidence: 99%