A comparison between Free-Anchored and Anchored cMUT membranes for NDT applications using MUMPS manufacture process

Octavio, A.; Martínez-Graullera, Óscar; Martín, Carlos Javier Blanco; Gomez-Ullate, L.; Espinosa, F. Montero de

doi:10.3728/icultrasonics.2007.vienna.1409_octavio

Cited by 2 publications

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“…Nevertheless, this specific case has shown the possibility of developing Symmetric Binned-arrays which implies a reduction of the manufacturing costs, a simplification of the design process and a reduction of the element interconnection routing. Moreover, as each membrane has etching holes used to remove the sacrificial oxide, radiation from these holes will be produced out of phase with that from the membrane when the transducer is in operation (Octavio et al 2007b). This will decrease the transducer efficiency in emission due to destructive interference.…”

Section: Discussionmentioning

confidence: 98%

Air-coupled linear and sparse cMUT array manufactured using MUMPs process

et al. 2011

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An assessment of the standard fabrication Micro-Electro-Mechanical Systems (MEMS) process Multi-User MEMS Processes (MUMPs) for complex air-coupled capacitive Micromachined Ultrasonic Transducer array aperture manufacture is reported. A 1-D linear array and a 2-D sparse symmetric binned-array have been designed and manufactured, and then characterised experimentally using electrical impedance measurements, laser vibrometry and air-coupled field measurement; the experimental data are supported by simulated data using Finite Element technique and field simulation based on Huygens’ principle. A methodology for the manufacture of the array structures using the MUMPs process is described. Electrical characterisation shows the devices operation at 770 kHz and the existence of large parasitic capacitances and electrical losses. Mechanical crosstalk of array substrate has been measured at -40 dB using laser vibrometry. Moreover, the laser vibrometry measurement and the field characteristics of one element reveal that each element operates as a piston radiator

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Section: Discussionmentioning

confidence: 98%

Air-coupled linear and sparse cMUT array manufactured using MUMPs process

et al. 2011

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“…The air gap of the capacitive device corresponds with the thickness of both sacrificial layers (2.75 µm). The holes in the membrane reduce the transducer's efficiency because they make the membrane unbaffled [4].…”

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P4M-2 A Linear CMUT Air-Coupled Array For NDE Based on MUMPS

Octavio

Martín²,

Martínez-Graullera³

et al. 2007

2007 IEEE Ultrasonics Symposium Proceedings

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In this paper, the design and characterization of a linear cMUT array based on MUMPS technology is presented. The array has 33 elements having each element 68×2 cMUT cells electrically connected in parallel. The single cell consists of a 130 µm square shaped polysilicon membrane, a gold top electrode, silicon nitride as the isolation layer between conductors and heavily doped silicon which works as the bottom electrode. The central frequency is 720 kHz. Electrical and optical measurements were performed and compared with FEM calculations. These results were used to study the mechanical and electrical behaviour of the device.

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A comparison between Free-Anchored and Anchored cMUT membranes for NDT applications using MUMPS manufacture process

Cited by 2 publications

References 0 publications

Air-coupled linear and sparse cMUT array manufactured using MUMPs process

Air-coupled linear and sparse cMUT array manufactured using MUMPs process

P4M-2 A Linear CMUT Air-Coupled Array For NDE Based on MUMPS

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