A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components

Jackson, K. P.; Flint, Edward B.; Cina, M.F.; Lacey, D.; Trewhella, J.M.; Caulfield, Thomas R.; Sibley, S.

doi:10.1109/ectc.1992.204190

Cited by 37 publications

(3 citation statements)

References 7 publications

(4 reference statements)

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“…More and more optoelectronic assemblies are being soldered and the processes have been reviewed by Basavanhally [1], and Tan and Lee [2]. These processes can be broken into the following four categories: (1) solder the assembly with no precision self-alignment [3,4], (2) solder and allow self-alignment with no mechanical stops [3][4][5][6][7][8][9][10], (3) solder and allow self-alignment with one mechanical stop [11][12][13], and (4) solder and allow self-alignment with two mechanical stops [14]. Self-aligning soldering technology is widely used for optoelectronic packaging because of its low cost.…”

Section: Introductionmentioning

confidence: 99%

“…During reflow, the molten solder spreads over the pads and creates momentarily a shape with higher energy (see Figure 1(b)), which causes the chip to move relative to the substrate until the solder joint attains the minimum total energy for an accurate alignment(see Figure 1(c)). Sometimes, misaligned solder joint profiles are preferred because they could be used to push one standoff against another for the alignment [14]. The aligning motion is affected by many design and manufacturing parameters [1,2].…”

Section: Introductionmentioning

confidence: 99%

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Gas flow effects on precision solder self-alignment

Gershovich²,

Lee³

1997

IEEE Trans. Comp., Packag., Manufact. Technol. C

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Self-aligning soldering technology is being developed for low cost, passive, precision optical alignments. To avoid contamination problems, the solder reflow process must use reacting or inert gas instead of chemical flux materials. Since the accuracy of these optical alignments should reach the range of a few micrometers (µm), the gas flow may affect the aligning process. Therefore, the effects of the gas flow on the self-aligning process must be understood. The experiments described show that gas flow effects do exist. The top plate, 8.4 mm × 8.4 mm, can be moved by the gas flow by as much as 4.5 µm and 7.8 µm at gas flow rates of 2.5 L/min and 5.0 L/min, respectively. The numerical analysis in this study models the gas flow effects for a wide range of chip sizes, solder geometry, and gas flow direction. In the numerical analysis, fluid computation and solder force calculation are conducted to study the gas flow effects on chip displacement that is the distance away from the well aligned position along the gas flow direction. The results show that the gas flow effects are related to many factors including chip size, gas flow rate, solder height, and flow direction. For a one-dimensional laser array, these effects are negligible because the chip size is very small. However, for a chip larger than 5 mm × 5 mm, the effects should be controlled for micron-level precision alignment.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Gas flow effects on precision solder self-alignment

Gershovich²,

Lee³

1997

IEEE Trans. Comp., Packag., Manufact. Technol. C

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“…Nevertheless, the alignment accuracy of 2 microns is insufficient to meet the required tolerances for single-mode fiber-to-chip coupling A combination of mechanical stops with the self align mechanism of the solder bumps has been used. An offset of the solder pads and lithographically-defined structures on tbe substrate halted the motion of the chip [12]. These mechanical stops could be defined with micron or sub-micron accuracy, thus the resulting alignment of the chip should be in the same range.…”

Section: Various Methods Of Flip Chip Assemblymentioning

confidence: 99%