A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applications

Lee, C.-H.; Sutono, A.; Han, Sang-Min; Laskar, J.

doi:10.1109/mwsym.2001.967048

Cited by 15 publications

(8 citation statements)

References 10 publications

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“…A highly integrated LTCC based transmitter module using GaAs metal-semiconductor field-effect transistor (MESFET) MMICs for Ku-band satellite communication applications is presented [8]. Figure 15 shows the 3D-configuration and picture of the module.…”

Section: Ku-band Transmitter Modulementioning

confidence: 99%

RF-system-on-package (SOP) for wireless communications

et al. 2002

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A new industrial revolution, often called the "third wave" or information technology (IT), is in the making. The products of this revolution will require entirely different systems hardware technologies: those with multifunctions, such as digital, analog, RF, and optical circuitries. RF and microwave design and packaging have been established as key technologies of this revolution. The demand for increasingly higher rates of data, voice, and video drives RF technology to ever higher frequencies where bandwidth for channel capacity is easy to find. Such emerging high-performance applications as personal communication networks, wireless local-area networks (WLAN), and RF-optical networks have defined a trend toward more flexible and reconfigurable systems. They impose very stringent specifications never before reached in term of low noise, high linearity, low power consumption, small size and weight, and low cost.The RF front-end module is the foundation of these systems, and its integration poses a great challenge. Microelectronics technology, since the invention of the transistor, has revolutionized many aspects of electronic products. This integration and cost path has led the microelectronics industry to believe that this kind of progress can go on forever, leading to so-called "system-on-chip" (SOC) for all applications. But it is becoming clear that the production of a complete solution for the new wireless communication front-end is still a dream. When you consider the characteristics of an RF front-end module • high performance up to 100-GHz operating frequency • a large number of high-performance discrete passive components • design flexibility • reconfigurable architecture • low power consumption • compactness • product customization • short time to market and low cost the system-on-package approach (SOP) has emerged as the most effective to provide a realistic integration solution because it is based on multilayer technology using low-cost and high-performance materials [1], [2]. Multilayer topology high-density hybrid interconnect schemes, as well as various compact passive structures, including inductors, capacitors, and filters, can be directly integrated into the substrate. Thus, a high-performance module can be implemented while simultaneously achieving cost and size reduction.This article illustrates the performance of the next-generation SOP integrated module, including • the features of the SOP concept for RF front-end module integration • development efforts on the embedded passive library and 3D modules for wireless applications • high-performance, organic-based, multichip-module (MCM) technology. What Is RF-SOP?In the future, wireless communication will require better performance, lower cost, and smaller RF front-end size. To meet critical specifications, it is common to use discrete passive components, such as surface acoustic wave (SAW) filters and packaged inductors. Although much effort has been devoted to the realization of SOC in RF areas using Si based technology, SOC is considered a so...

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Section: Ku-band Transmitter Modulementioning

confidence: 99%

RF-system-on-package (SOP) for wireless communications

et al. 2002

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“…The integration of magnetic properties into existing dielectric LTCC structures would have a dramatic impact on the miniaturization and application potential of LTCC devices in modern electronics [4]. In open literature the design procedure has been well reported for embedded capacitors, inductors, resonators and transmission lines in LTCC technology [5][6][7], but only few papers deal with LTCC ferrite transformers [8,9]. One of the reasons for this situation is that, although the design of the microtransformer should be such that close flux coupling is realized between the primary and secondary coils, the design guidelines have not yet been clarified.…”

Section: Introductionmentioning

confidence: 99%

Performance analysis of LTCC transformers for application in DC/DC converters

Stojanović

Marić

Radosavljevic

et al. 2010

Proceedings of 14th International Power Electronics and Motion Control Conference EPE-PEMC 2010

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In this paper, a novel design of a LTCC (low temperature co-fired ceramics) transformer for application in DC/DC converters is proposed. The transformer possesses a compact structure with the coils surrounded by dielectric (or ferrite) material and between the coils one dielectric layer is placed. Simulation and measuring results for inductance, coupling coefficient and quality factor of the proposed transformer are also presented. Testing LTCC transformer characteristics is illustrated using a forward type of DC/DC converter.

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“…LTCC enables passive components embedded compactly and low-cost RF modules with high-density multilayered structures [1]- [3]. The current drawbacks of most RF module are their relatively large size, heavy weight primarily caused by discrete components such as the filters, and separately located modules [4].…”

Section: Introductionmentioning

confidence: 99%

Filter embedded K-band LTCC upconverter

Jeong¹,

Yom²,

Lee³

et al. 2007

2007 European Microwave Conference

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A Low Temperature Cofired Ceramics (LTCC) upconverter is presented. Two filters are embedded under the MMIC mixer. One is an S-band low pass filter with multi-pole configuration for image rejection and the other is a K-band band pass filter with layer coupled configuration for harmonic rejection. The size of the LTCC upconverter is only 7 x 8 mm 2 . The results of each filter and the upconverter show good performances and agreements with simulation results. Conversion loss and harmonic rejection of the upconverter are 9 dB and 51 dBc, respectively.

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A compact LTCC Ku-band transmitter module with integrated filter for satellite communication applications

Cited by 15 publications

References 10 publications

RF-system-on-package (SOP) for wireless communications

RF-system-on-package (SOP) for wireless communications

Performance analysis of LTCC transformers for application in DC/DC converters

Filter embedded K-band LTCC upconverter

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