2021
DOI: 10.1109/tap.2020.3001668
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A Combination of Transmission Line Models as Design Instruments for Electromagnetically Coupled Microstrip Patch Antennas in the 2.45 GHz ISM Band

Abstract: This communication presents an analytical framework that combines transmission line models for the design of electromagnetically coupled microstrip patch antennas for the 2.45 GHz industrial, scientific and medical band. It provides initial values for all dimensions of the antenna, with measured resonance frequency errors below 6%. The initial design is optimized in two subsequent phases to center the resonance frequency and to increase the impedance bandwidth (BW), obtaining measured resonance frequency error… Show more

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Cited by 7 publications
(5 citation statements)
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“…On-body performance of the EMCMPA is verified in [28], with good agreement between simulation and measurement. In order to verify that rectenna configuration maintains the on-body performance, new measurements were made, as shown in Figure 17.…”
Section: Array Measurementsmentioning
confidence: 80%
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“…On-body performance of the EMCMPA is verified in [28], with good agreement between simulation and measurement. In order to verify that rectenna configuration maintains the on-body performance, new measurements were made, as shown in Figure 17.…”
Section: Array Measurementsmentioning
confidence: 80%
“…The novelty of the proposed textile rectenna is based on the combination of the EMCMPA topology [28] and a simple and precise construction method [29] that provides a good performance repeatability for multilayer microstrip textile patch antennas. Thus, the patches and the rectifier circuit pads are laser-cut, and the different layers are attached with double-sided, thermally activated adhesive sheets.…”
Section: Rectenna Designmentioning
confidence: 99%
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“…Lightweight, affordable, conformal, low-profile, and suitable with integrated circuits is just a few features of PCB antennas. Common feeding methods employing transmission lines [19], coupled apertures [20]- [22], or electromagnetic [23], [24], coplanar waveguides [25]- [27], and coaxial probes [28], [29]. Due to their uniplanar implementation and development of vias, coplanar waveguides have the advantage of being simple to integrate with active devices.…”
Section: Introductionmentioning
confidence: 99%
“…Besides Dk and Df, the electrical performances of designed circuits are related to some other parameters of CCL, such as the moisture absorption, thermal coefficient, copper peel, and so on, and even the CCL manufacturing process, especially for the frequency of millimeter‐wave or terahertz bands. In recent years, the researchers mainly focus on some areas for circuit performance improvements, such as the performance investigation for accurate design of various circuits, 1,2 flexion modification for flexible or conformal applications, 3–5 improvement of manufacturing process, 6,7 usage of advanced material, 8 and gap waveguide technique 9,10 . It is known that the adhesive layer is normally necessary in traditional lamination process, which is composed of epoxy and acrylic resin.…”
Section: Introductionmentioning
confidence: 99%