A co-optimization method of thermal-stress coupling 3D integrated system with through silicon via

Wang, Xianglong; Chen, Dongdong; Li, Di; Yang, Yintang

doi:10.1007/s00158-023-03706-6

Struct Multidisc Optim

2023

DOI: 10.1007/s00158-023-03706-6

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A co-optimization method of thermal-stress coupling 3D integrated system with through silicon via

Xianglong Wang,

Dongdong Chen,

Di Li

et al.

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A co-optimization method of thermal-stress coupling 3D integrated system with through silicon via

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References 54 publications

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