A CMOS compatible back end MEMS switch for logic functions

Joshi, V. K.; Khieu, Cong; Smith, Charles G.; Schepens, Cor; Csaszar, Farkas; Lacey, Damian; Nagata, Toshi; Renault, M.; Kampen, Rob van; Knipe, Richard; Yost, Dennis

doi:10.1109/iitc.2010.5510694

Cited by 15 publications

(2 citation statements)

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“…Alternatively, micro-electro-mechanical systems (MEMS) based storage-layer-free NVM has been proposed for high temperature operation and offers a new direction towards superior data retention at high temperatures [14,15]. Generally, MEMS based memories comprise a mechanically moving actuator (suspended cantilever or diaphragm) and their SET/ RESET operation is fundamentally based on the displacement control of a movable structure [16][17][18]. With proper selection of the high temperature resistant material, the MEMS based NVM devices were successfully developed for high temperature memory applications as they do not suffer from storage-layer-based charge leakage issues [19,20].…”

Section: Introductionmentioning

confidence: 99%

Anchor-free NEMS non-volatile memory cell for harsh environment data storage

Singh

Chua

Liang

et al. 2014

J. Micromech. Microeng.

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This work demonstrates a novel anchor-free nano-electromechanical (NEMS) based nonvolatile memory cell, suitable for high temperature (T ≤ 300 °C) and radiation prone harsh environment applications. The anchor-free circular metal beam is actuated by electrostatic force and is held in one of the bi-stable memory states by adhesion force between two smooth metal surfaces in contact. Smooth metal layers form strong van der Waals stiction between two surfaces in contact and memory detection (Logic-'1' / Logic-'0') is obtained by detecting the conductance between two fixed contacts. This anchor-free design offers highest density (9F 2 footprint) compared to other mechanical memory devices reported to date.

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Section: Introductionmentioning

confidence: 99%

Anchor-free NEMS non-volatile memory cell for harsh environment data storage

Singh

Chua

Liang

et al. 2014

J. Micromech. Microeng.

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“…Furthermore, the effect of radiation such as cosmic rays can no longer be ignored with the semiconductor devices of recent years which have been designed with increasingly high density and speed for use on earth. These considerations have spurred on research into various MEMS logic circuits [1,2,3,4,5,6,7]. However, most of the previous studies concern the simple replacement of the transistor switch, used in the logic circuits constructed from transistors, with a MEMS switch.…”

Section: Introductionmentioning

confidence: 99%

Microelectromechanical XNOR and XOR logic devices

Mita

Ataka

Toshiyoshi

2013

IEICE Electron. Express

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Abstract:We have developed a new microelectromechanical logic device using the MEMS (Micro Electro Mechanical Systems) technology. This device consists simply of a single cantilever and two driving electrodes with two contact pads for electrostatic operation. Both exclusive NOR (XNOR) and exclusive OR (XOR) logic devices have been realized using this simple construction. Keywords: logic circuits, space applications, mechanical switch, electrostatic pull-in Classification: Micro-or nano-electromechanical systems References[1] S.-W. Lee, R. Johnstone, and A. M. Parameswaran, "MEMS mechanical logic units: characterization and improvements of devices fabricated with MicraGEM and PolyMUMPs,"

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