A clean wafer-scale chip-release process without dicing based on vapor phase etching

Overstolz, T.; Clerc, P.-A.; Noell, Wilfried; Zickar, Michael J.; Rooij, N. F. de

doi:10.1109/mems.2004.1290685

Cited by 37 publications

(28 citation statements)

References 6 publications

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“…The 10-µm-thick device layer of an SOI wafer is structured into the mirrors and the frame by deep reactive-ion etching (DRIE). At the same time, the trenches for the dice free release [8] have been defined. During the next step, 2.2 µm thermal wet silicon dioxide is grown in order to fill the trenches between the mirrors and the frame.…”

Section: Fabricationmentioning

confidence: 99%

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Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

Waldis

Zamkotsian

Clerc

et al. 2007

IEEE J. Select. Topics Quantum Electron.

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Abstract-Micromirror arrays are promising components for generating reflective slit masks in future multiobject spectrographs. The micromirrors, 100 µm × 200 µm in size, are etched in bulk single crystal silicon, whereas a hidden suspension is realized by surface micromachining. The micromirrors are actuated electrostatically by electrodes located on a second chip. The use of silicon on insulator (SOI) wafers for both mirror and electrode chip ensures thermal compatibility for cryogenic operation. A system of multiple landing beams has been developed, which latches the mirror at a well-defined tilt angle when actuated. Arrays of 5 × 5 micromirrors have been realized. The tilt angle obtained is 20• at a pull-in voltage of 90 V. Measurements with an optical profiler showed that the tilt angle of the actuated and locked mirror is stable with a precision of 1 arcmin over a range of 15 V. This locking system makes the tilt angle independent from process variations across the wafer and, thus, provides uniform tilt angle over the whole array. The surface quality of the mirrors in actuated state is better than 10-nm peak to valley and the local roughness is about 1-nm root mean square.Index Terms-Deep reactive-ion etch (DRIE), micromirror, microoptoelectromechanical system (MOEMS), mirror array, multiobject spectroscopy (MOS).

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Section: Fabricationmentioning

confidence: 99%

“…In a final DRIE step, the backside openings of the mirror and the dice free chip release trenches are etched into the 350-µm handle layer. First, the mirrors and then, the whole chips are released in a dry hydroflouro (HF) vapor etch step [8]. The mirror chips are now ready to be assembled with the electrode chip.…”

Section: Fabricationmentioning

confidence: 99%

Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

Waldis

Zamkotsian

Clerc

et al. 2007

IEEE J. Select. Topics Quantum Electron.

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“…First the mirrors and then the whole chips are released in a dry HF vapor etch step. 6 The mirror chips are now ready for assembly with the electrode chip. Figure 6 shows micrographs of released single mirrors with torsion and flexion suspension.…”

Section: Realizationmentioning

confidence: 99%

High-fill factor micro-mirror array for multi object spectroscopy

et al. 2006

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Programmable multi-slit masks are required for next generation Multi-Object Spectrograph (MOS) for space as well as for ground-based instruments. A promising solution is the use of MOEMS devices such as micromirror arrays (MMA) or micro-shutter arrays (MSA), which both allow the remote control of the multi-slit configuration in real time. In the present work we developed and microfabricated a novel micro mirror array suited for this application. The requirements are: high contrast, optically flat (λ/20) mirrors in operation, high fill factor, uniform tilt angle over the whole array and low actuation voltage. In order to fulfill these requirements we use a combination of bulk and surface micromachining in silicon. The mirrors are actuated electrostatically by a separate electrode chip. The mirrors are defined by deep reactive ion etching in the 10µm thick device layer of a silicon-on-insulator (SOI) wafer, whereas the suspension of the mirrors is defined by a patterned poly-silicon layer hidden on the backside of the mirrors. The mirror size is 100 x 200 µm 2 and the dimensions of a typical cantilever suspension are 100 x 5 x 0.6 µm 3 . On a separate SOI wafer the electrodes and the spacers are processed by using a self aligned delayed mask process. The first results on the mirror chips show that the micromirrors can easily achieve the desired mechanical tilt angle of more than 20• associated with a good surface quality, which is necessary for a high contrast spectroscopy.

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“…The device is micro-fabricated on SOI wafers by double-side etching with Deep Reactive Ion Etching (DRIE). The release and singulation of the device is made by vapor phase hydrofluoric acid etching (HF VPE) [3].…”

Section: Introductionmentioning

confidence: 99%

Scalable cascaded snap-in actuators for large-stroke displacements

Golay

Masse

Pétremand

et al. 2009

TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference

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This paper will focus on the design, and first measurements of a cascaded in-plane parallel plate snap-in actuator. The actuator is based on a rather simple microfabrication process and can achieve a total displacement of several tenths of microns. Compared to classical noncascaded transducer device based on parallel plates or comb-drive actuator, the actuation voltage is relatively low due to the snap-in phenomenon of electrostatic actuators. The electromechanical response of such a device is sequential. The fabricated 4-stage device shows a total stroke of 75 µm at 60 V. It is possible to easily increase the total stroke of the actuator by increasing the number of stages. Only one input electrode is required. Simulations with CoventorWare showed easy scalability of the concept for up to 19 stages with a total displacement of 350 µm.

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A clean wafer-scale chip-release process without dicing based on vapor phase etching

Cited by 37 publications

References 6 publications

Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

Arrays of High Tilt-Angle Micromirrors for Multiobject Spectroscopy

High-fill factor micro-mirror array for multi object spectroscopy

Scalable cascaded snap-in actuators for large-stroke displacements

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