A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies

Lim, M. H.; Wyk, J.D. van; Lee, F.C.; Ngo, Khai D. T.

doi:10.1109/tpel.2008.921180

Cited by 67 publications

(15 citation statements)

References 41 publications

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“…CPES has conducted a series of studies for 3D POL integration using the low profile LTCC inductors as a substrate [128]- [136]. The use of low profile inductors allows for more efficient use of space when integrated with the active devices.…”

Section: Ltcc Integration Technologymentioning

confidence: 99%

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Wang¹

2017

CPSS TPEA

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Section: Ltcc Integration Technologymentioning

confidence: 99%

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Wang¹

2017

CPSS TPEA

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“…LTCC ferrite is actually ferrite particles mixed with a ceramic tape material. The thin, flexible LTCC tape layers can be stacked together in various shapes, pressed, and then fired in an oven to create a hard ferrite structure [7], [8]. Compared with traditional ferrite material such as NiZn ferrite, LTCC ferrite can have almost the same permeability and core loss density, but it has much more flexibility for building integrated magnetic components [9].…”

Section: Active Layermentioning

confidence: 99%

Overview of three-dimension integration for Point-of-Load converters

Lee

2013

2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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High density integrated Point-of-Load (POL) converter is today's industry trend for portable electronic applications. In the past 10 years, Center for Power Electronics Systems (CPES) spent tremendous research efforts in this area and has successfully demonstrated a three-dimension (3D) integration method using magnetic as a substrate to achieve a very high power density at a high current level. CPES not only proposed a series of methods to reduce parasitic inductance of active layer for high frequency operation, but also developed several advanced low profile magnetic structures for 3D integration. This paper gives an overview of CPES's 10-year research efforts on high density 3D integrated POL converters. With CPES's latest technologies, a 20A POL converter with GaN devices was demonstrated with power density as high as 1000W/in 3 , which is a factor of 10 improvements compared to industry products.

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“…[1][2] Some researchers investigated the applications of these materials in high current high frequency power conversion. [3][4] [5] LTCC technology for power electronics hybrid integration provides various advantages in terms of thermal coefficient of expansion (CTE) matching with silicon [6], the potential for higher power conversion. In addition, the thermal conductivity of LTCC (2.5 to 4.0 W/m °K) is around 10 times higher than that of PCB (0.2 to 0.3 W/m °K), which makes LTCC a better candidate for magnetic substrate than other materials.…”

Section: Introductionmentioning

confidence: 99%

Laminated low temperature co-fired ceramic ferrite materials and the applications for high current POL converters

Wen-li

Lee

et al. 2013

2013 IEEE Energy Conversion Congress and Exposition

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Low temperature co-fired ceramic (LTCC) ferrite materials are a group of materials for magnetic substrate of integrated power converters. The inductors can be fabricated in the substrate so that the power density of the converter can be dramatically increased. There are three types of commercial LTCC ferrite materials from ESL ElectroScience®: 40010, 40011 and 40012. However, these materials are not optimized for high current integrated point-of-load (POL) converters. In this paper, the LTCC materials are improved by laminating different LTCC green tapes. The lamination impact to the microstructure and composition is analyzed and discussed. After comparisons, a new LTCC material with better composition for power converters is found. Both magnetic characterization and planar inductor demonstration have shown that the new material is more suitable for high current integrated POL converter applications.

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A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies

Cited by 67 publications

References 41 publications

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Overview of three-dimension integration for Point-of-Load converters

Laminated low temperature co-fired ceramic ferrite materials and the applications for high current POL converters

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