2012 IEEE Radio Frequency Integrated Circuits Symposium 2012
DOI: 10.1109/rfic.2012.6242271
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A class-G dual-supply switched-capacitor power amplifier in 65nm CMOS

Abstract: A digitally-controlled switched-capacitor RF power amplifier (SCPA) that uses a dual-supply voltage, class-G architecture is implemented in 65nm CMOS. It implements signal envelope digital-to-analog conversion using switching functions controlled by digital logic to achieve superior efficiency and linearity at output power backoff. The SCPA delivers a peak (average) output power of 24.3 (16.8) dBm with a peak (average) PAE of 44% (33%) for an IEEE 802.11g signal (64 QAM OFDM) with a measured EVM of 2.9 % in th… Show more

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Cited by 10 publications
(3 citation statements)
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“…The efficiency improvement comes from the fact that for lower signal levels, the low power part operates twice as efficiently as its high power counterpart. Therefore, this is beneficial when signals are applied that typically don't often need the high output power [23]. …”
Section: Class Gmentioning
confidence: 99%
“…The efficiency improvement comes from the fact that for lower signal levels, the low power part operates twice as efficiently as its high power counterpart. Therefore, this is beneficial when signals are applied that typically don't often need the high output power [23]. …”
Section: Class Gmentioning
confidence: 99%
“…One specific architecture of RF-DACs is the so-called capacitive RF-DAC or switched-capacitor PA (SCPA), which was first published in the literature by Yoo et al [18]- [20]. The capacitive RF-DAC combines high linearity over a wide frequency range with high power efficiency [18].…”
mentioning
confidence: 99%
“…Hence, digital predistortion could be needed [72]. Yoo et al [73,74] proposed a digitally-controlled switchedcapacitor RF PA (SCPA) with Class G architecture to further increase linearity and efficiency as shown in Figure 3.12. However, their output matching network, which could be a source of power losses, parasitics and complexity of design, was done off-chip to reduce the die area.…”
Section: Envelope Tracking Pa Topologymentioning
confidence: 99%