2017
DOI: 10.1109/ted.2016.2622403
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A Charge-Plasma-Based Dielectric-Modulated Junctionless TFET for Biosensor Label-Free Detection

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Cited by 185 publications
(70 citation statements)
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“…Therefore, the source doping concentration was selected as 5 × 10 17 cm −3 in order to obtain maximal Ion/Ioff value. 60 mV/Dec -1.0x10 -4 0.0 1.0x10 -4 2.0x10 -4 3.0x10 -4 4.0x10 -4 5.0x10 -4 6.0x10 -4 7.0x10 -4 8.0x10 -4 Drain Current (A/μm) 0.0 2.0x10 18 4.0x10 18 6.0x10 18 8.0x10 18 1.0x10 19 3.6x10 -4 3.9x10 -4 4.2x10 -4 4.5x10 -4 4.8x10 -4 5.1x10 -4 5.4x10 -4 5.7x10 -4 6.0x10 -4 Vds = 1V,Vgs = 1.2V 4.0x10 -18 6.0x10 -18 8.0x10 -18 1.0x10 -17 1.2x10 -17 1.4x10 -17 1.6x10 -17 1.8x10 -17 2.0x10 We mentioned above that the gate electrode was divided into three parts namely auxiliary gate (M1), control gate (M2) and tunnel gate (M3) with workfunctions ΦM1, ΦM2 and ΦM3, respectively, where ΦM1 = ΦM3 < ΦM2. Next, the effects of the three parameters on the transfer characteristics will be discussed.…”
Section: Effect Of Device Parameters On the Transfer Characteristicsmentioning
confidence: 99%
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“…Therefore, the source doping concentration was selected as 5 × 10 17 cm −3 in order to obtain maximal Ion/Ioff value. 60 mV/Dec -1.0x10 -4 0.0 1.0x10 -4 2.0x10 -4 3.0x10 -4 4.0x10 -4 5.0x10 -4 6.0x10 -4 7.0x10 -4 8.0x10 -4 Drain Current (A/μm) 0.0 2.0x10 18 4.0x10 18 6.0x10 18 8.0x10 18 1.0x10 19 3.6x10 -4 3.9x10 -4 4.2x10 -4 4.5x10 -4 4.8x10 -4 5.1x10 -4 5.4x10 -4 5.7x10 -4 6.0x10 -4 Vds = 1V,Vgs = 1.2V 4.0x10 -18 6.0x10 -18 8.0x10 -18 1.0x10 -17 1.2x10 -17 1.4x10 -17 1.6x10 -17 1.8x10 -17 2.0x10 We mentioned above that the gate electrode was divided into three parts namely auxiliary gate (M1), control gate (M2) and tunnel gate (M3) with workfunctions ΦM1, ΦM2 and ΦM3, respectively, where ΦM1 = ΦM3 < ΦM2. Next, the effects of the three parameters on the transfer characteristics will be discussed.…”
Section: Effect Of Device Parameters On the Transfer Characteristicsmentioning
confidence: 99%
“…As a whole, TFETs reported in recent years adopt abrupt junction at tunneling interface, which leads to a complex fabrication processes and a high thermal budget. In addition, a heavily doped concentration in the channel and active region are also challenging during the fabrication process and it is easy to be influenced by random dopant fluctuations (RDFs) [17][18][19][20][21].…”
Section: Introductionmentioning
confidence: 99%
“…The cutoff frequency (f T ) and GBW product are important indicators for evaluating the frequency characteristics of DLTFETs and H-DLTFETs [32]. In Equation (2), the f T can be expressed by a ratio of g m to C gg [33,34].…”
Section: Frequency Characteristicmentioning
confidence: 99%
“…To address these issues, a lot of novel structures of TFETs are proposed [8][9][10][11][12][13][14][15][16][17][18][19]. As a whole, most of TFETs reported in recent years adopt different doping concentration in channel and active regions to form heavily doped abrupt junction at tunneling interface, which leads to a complex fabrication processes and a high thermal budget, what's more, introduction of high-density layer at source/channel junction and Gaussian doping in drain region also find difficultly during fabrication process and it's easy to be influenced by random dopant fluctuations (RDFs) [20][21][22][23].…”
Section: Introductionmentioning
confidence: 99%