A Changing Capacitor Technology - Failure Mechanisms and Design Innovations

Shaw, David G.; Cichanowski, S. W.; Yializis, A.

doi:10.1109/tei.1981.298435

Cited by 108 publications

(24 citation statements)

References 2 publications

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“…Higher energy densities can be achieved by enhancing the electrode capacitance, which can be reached via high capacitance electrode materials. This induced the exploration of alternate electrode materials, such as nanocomposite materials, to increase the capacitance by using nanoscale systems, or faster electronic and ionic transport characteristics [34,35].…”

Section: Economies Of Scalementioning

confidence: 99%

Performance of Commercially Available Supercapacitors

2017

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High energy density storage device exhibiting a reliable lifecycle is needed in the 21st century. Hence, energy storage research is critical for reducing energy consumption. Supercapacitors exhibit such characteristics via interfacial ion electrosorption and fast redox reactions. They are a feasible solution for transportation applications, among others, due to their superb characteristics. In this paper, we provide a background on supercapacitors, review public data on commercially available supercapacitors for performance characteristics, and finally summarize their performance in terms of energy density, equivalent series resistance, and device time consistency.

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Section: Economies Of Scalementioning

confidence: 99%

Performance of Commercially Available Supercapacitors

2017

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“…Nordic Insulation Symposium -Nord-IS 13 -Trondheim, Norway, June 9 -12, 2013 As multiple self-healing breakdowns are measured per sample area, only the breakdowns which appear independent should be chosen for further statistical analysis. One approach for the selection is to analyze the discharge energy behavior of the measured self-healing breakdowns on the basis of the power dependence E SH =aU b [13].…”

Section: Hv Source Groundmentioning

confidence: 99%

Effect of Film Thickness and Electrode Area on the Dielectric Breakdown Characteristics of Metallized Capacitor Films

Rytöluoto¹,

Lahti²

2018

NORD-IS

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An alternative approach for measuring breakdown characteristics of metallized and non-metallized polymer films has been previously developed at TUT. The method enables measurement of multiple breakdowns beyond the weakest point of each sample film by utilizing low-energy self-healing breakdown of metallized film. The method yields a large amount of breakdown data even from a relatively small sample area which enables the formation of detailed material-specific breakdown fingerprints. In this paper, some preliminary results of an ongoing further research on the area and thickness dependence of the breakdown characteristics of various polymer films are presented.Dielectric polymer films utilized in film capacitors are subjected to very high electric field stresses and thus, accurate statistical knowledge of their breakdown characteristics at the low breakdown probability region is of utmost importance in order to ensure safe and reliable design and operation in practice [1][2][3][4]. Breakdown measurement is typically realized as a short-term rampto-breakdown measurement and Weibull or other extreme-value distributions are then utilized for statistical analysis of the breakdown data [5]. However, weak spots in the polymer film due to the internal morphology and inherent properties of the polymer itself or due to extrinsic factors such as defects, voids, chemical impurities and non-ideal processing conditions can lead to a large deviation in the breakdown strength [6]. Moreover, the area and volume dispersion of the weak points in the film further complicates the dielectric strength evaluation [7][8][9]. Therefore, a large amount of breakdown data is required from a relatively large test area in order to gain a sufficient statistical relevance for practical applications. One approach for obtaining a large amount of breakdown data is to utilize an automatic breakdown strength measurement system such as in [10][11]. However, especially when the development and optimization phase of new dielectric materials such as polymer nanocomposites is considered, weak spots due to non-ideal processing conditions or other external factors may have a deteriorating effect on the dielectric breakdown strength [12]. Moreover, as the amount of sample material available for breakdown measurement may be scarce, the dielectric breakdown strength determined with only a small number of parallel samples may be misleading as it may be more representative of the weak spots due to extrinsic factors rather than a measure of the inherent properties of the material. Consequently, the true potential of the new dielectric may not be revealed completely. In return to this problem, an alternative approach for measuring breakdown characteristics of thin polymer films has been previously developed at TUT [13]. The method is based on the concept of measuring multiple breakdowns per sample film beyond the weakest point (or dielectric strength) of each film by utilizing lowenergy self-healing breakdown of metallized polymer film which effectively reduces ...

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“…This has been shown for polypropylene films by Shaw, et.al. [26] Also, an increase in dielectric thickness and surface roughness corresponds to an increase in partial discharge values. The DIV and DEV usually increase with thickness, such as for Mylar, [2 7 ] and with surface roughness, such as for polypropylene.…”

Section: H Moisture Contentmentioning

confidence: 99%