2008 IEEE International Conference on Semiconductor Electronics 2008
DOI: 10.1109/smelec.2008.4770354
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A case study of a change in migration behaviour of a transferred AlCu metallization

Abstract: The work presented here shows a change in migration behaviour of a transferred AlCu metallization system. Different failure mechanisms in metallization are known. Migration effects like electro-, thermo-and stress migration are the main failure mechanisms in a metallization. This study shows the detection and exploration of a significant change in the migration mechanism of a wide lines of a top level interconnect of a standard metallization. The study demonstrates the differences of the transferred metallizat… Show more

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