2010 IEEE International Conference on Mechatronics and Automation 2010
DOI: 10.1109/icma.2010.5589034
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A calibration procedure and testing of MEMS inertial sensors for an FPGA-based GPS/INS system

Abstract: Given the burgeoning demand for a small, lightweight, consume very little power, low-cost high performance inertial Measurement Units(IMU), test methods are necessary to evaluate the current state of the available of Micro-Electro-Mechanical Systems(MEMS) technology. A reliable and efficient calibration and testing method for evaluating the performance of MEMS IMU is developed, by virtue of MEMS sensor suffering from various errors that have to be calibrated and accomplished to get acceptable navigation result… Show more

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Cited by 11 publications
(9 citation statements)
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“…This was as expected as the major acceleration occurs in these two axes. RMS errors in X-, Y-and Z-axes were similar with values of 0.47, 0.36 and 0.45 ms 22 , respectively. Coefficient of determination for velocity was high for the Y-and Z-axes (R 2 = 0.955 and 0.951, respectively, with p = 0.05).…”
Section: Validation Of Hardwaresupporting
confidence: 67%
See 1 more Smart Citation
“…This was as expected as the major acceleration occurs in these two axes. RMS errors in X-, Y-and Z-axes were similar with values of 0.47, 0.36 and 0.45 ms 22 , respectively. Coefficient of determination for velocity was high for the Y-and Z-axes (R 2 = 0.955 and 0.951, respectively, with p = 0.05).…”
Section: Validation Of Hardwaresupporting
confidence: 67%
“…Each sensing axis can be subjected to + 9.81, 0 and 29.81 ms 22 by a sequence of orientations with respect to the gravity vector, while the six-position and angular rate tests were used to calibrate the accelerometers and gyroscopes used in the study. 22,23 An example output for Z-axis calibration and the corresponding linear regression output model are shown in Figure 14.…”
Section: Validation Of Hardwarementioning
confidence: 99%
“…The major dilemma was to discover the faulty origins in multiple devices that were put together on single test bench for mass production. Recently existing tools [89] have limitations to test specific MEMS devices electrically and mechanically. The emerging challenge is to analyze and identify unique source of failure during assessment of multiple die on single test stage.…”
Section: Issues In Device Level Testingmentioning
confidence: 99%
“…The deterministic model encapsulates the biases, scale factors and misalignments errors. The parameters associated to the deterministic error model can be obtained by two different approaches: (1) static procedure in a laboratory environment, such as in Wang, Hao, Wei, and Wang (2010) and (2) identification based procedure, with a cost function which incorporates the unknown parameters. See Skog and Händel (2006) for details.…”
Section: Introductionmentioning
confidence: 99%