2018
DOI: 10.1007/s42247-018-0018-9
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A brief overview of RF sputtering deposition of boron carbon nitride (BCN) thin films

Abstract: A great part of interest has been paid for fabricating new materials with novel mechanical, optical, and electrical properties. Boron carbon nitride (BCN) ternary system was applied for variable bandgap semiconductors and systems with extreme hardness. The purpose of this literature review is to provide a brief historical overview of B 4 C and BN, to review recent research trends in the BCN synthesizes, and to summarize the fabrication of BCN thin films by plasma sputtering technique from B 4 C and BN targets … Show more

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Cited by 21 publications
(11 citation statements)
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“…The transfer of momentum ejects the particles from the target, condensing them on the substrate. This technique is considered particularly reliable for thick c-BN and for BCN coatings on cutting tools with high resistance surfaces [86].…”
Section: Making Of 2d Bn Materialsmentioning
confidence: 99%
“…The transfer of momentum ejects the particles from the target, condensing them on the substrate. This technique is considered particularly reliable for thick c-BN and for BCN coatings on cutting tools with high resistance surfaces [86].…”
Section: Making Of 2d Bn Materialsmentioning
confidence: 99%
“…In RF sputtering of BCN films, the main parameters are gas flow rate (N 2 ), deposition temperature, sputtering power, annealing temperature and bias voltage. 151 The substrate temperature and bias voltage variation provides control over bond contents in BCN films. The increase of N 2 flow decreases elastic modulus, wear resistance and hardness in BCN films.…”
Section: Synthesis Of Bcnmentioning
confidence: 99%
“…Sputtering is a physical vapor deposition procedure with a high film deposition rate and low-temperature structures, making it a good technique [67,68]. It is fast and inexpensive to create thin films of alloys, metals, nitrides, carbides, and oxides [69][70][71].…”
Section: B Sputtering Techniquesmentioning
confidence: 99%
“…The integrated pulse energy, time of deposition, pressure in the chamber, plasma gas, target-to-substrate angle, and substrate temperature are all crucial elements in diminishing dopant redistribution and defect creation during high-temperature processing. There are several types of high-quality thin films, such as boron carbon nitride [68], aluminum oxide [75], gallium oxide [76], and others [77], deposited via the magnetron sputtering technique [67]. For readers interested in the history of the thin-film sputter deposition process, we recommend consulting the reference [78].…”
Section: B Sputtering Techniquesmentioning
confidence: 99%