2021 IEEE International Electron Devices Meeting (IEDM) 2021
DOI: 10.1109/iedm19574.2021.9720639
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A Back Illuminated 6 µm SPAD Pixel Array with High PDE and Timing Jitter Performance

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Cited by 20 publications
(18 citation statements)
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“…Generally speaking, developing larger arrays allows a parallelization of the acquisition, reducing the measurement time. However, SPAD arrays still present relatively large pixel pitch (down to 6 μm in the best case [74]) and higher power consumption with respect to conventional image sensors. On the other hand, operating in Geiger mode, they provide single photosensitivity.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Generally speaking, developing larger arrays allows a parallelization of the acquisition, reducing the measurement time. However, SPAD arrays still present relatively large pixel pitch (down to 6 μm in the best case [74]) and higher power consumption with respect to conventional image sensors. On the other hand, operating in Geiger mode, they provide single photosensitivity.…”
Section: Discussionmentioning
confidence: 99%
“…Sony published in Kumagai [72] a 189 × 600 SPAD array in 90 nm SPAD/40 nm logic, developed for LiDAR, demonstrating remarkably high detection efficiency in the NIR (22% at 905 nm) and making use of SPAD clusters for coincidence detection and built-in Digital Signal Processing (DSP) blocks to process the timing information, allowing successful ranging beyond 150 m. A second sensor presented by the same company in Ogi [73] targets lowlight imaging, exploiting the same technology to implement high frame rate color imaging over a large dynamic range, by dynamically combining SPC at low light levels with measuring the time required for overflowing the same counter at higher photon fluxes. The company, in Shimada [74], presented its new generation of stacked SPAD arrays, manufacturing the readout chip in 22 nm CMOS, reducing SPAD pitch to 6 μm and increasing detection efficiency beyond 30% at 905 nm.…”
Section: D-stacked Complementary Metal-oxide Semiconductor Single-pho...mentioning
confidence: 99%
“…For example, we previously achieved a 2× increase in fill factor by integrating a custom microlens array onto the chip, [14] while other SPADs have used a combination of microlenses and 3D stacking to optimize the fill factor. [19] Recently developed SPADs [20] featuring multibit pixels and efficiency > 50% will likely lead to further substantial additional improvements in signal to noise ratios, with greater proportions of detected photons reducing the When the optical trace of cell #1 was compared with the ground-truth electrical trace, the correctly detected spikes were marked with a red dot, the false negative spikes were marked with a grey dot, the false positive spikes were marked with a grey cross. E,F) Peristimulus time histogram (PSTH) of spiking activity between Cell #1 and Cell #2 from (B).…”
Section: Discussionmentioning
confidence: 99%
“…For example, we previously achieved a 2× increase in fill factor by integrating a custom microlens array onto the chip, [ 14 ] while other SPADs have used a combination of microlenses and 3D stacking to optimize the fill factor. [ 19 ] Recently developed SPADs [ 20 ] featuring multibit pixels and efficiency > 50% will likely lead to further substantial additional improvements in signal to noise ratios, with greater proportions of detected photons reducing the shot noise. For example, while the SPAD we used here was designed for acquisition of binary frames to allow for compact pixels built into a relatively large array, introduction of multi‐bit photon counting will increase the dynamic range of the sensor, potentially enabling lower magnification objectives to be used, and more neurons to be captured in the field of view.…”
Section: Discussionmentioning
confidence: 99%
“…Recent advances in SPAD detector design have shrunk the SPAD pitch down to 6 µm [3] and the first 2D SPAD arrays at a similar pitch were reported in [2] and [3]. However, both pixel designs remain single-bin and leave the time-of-flight signal integration outside the pixel matrix.…”
Section: Introductionmentioning
confidence: 99%