A 60 V BiCDMOS device technology for automotive applications

Hamada, Keisuke; Kawai, Fumiaki; Kushida, Takashi; Kawahashi, Akira

doi:10.1109/ias.1995.530408

Cited by 6 publications

(2 citation statements)

References 6 publications

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“…Abbildung 7.6 zeigt eine mögliche Kombination bei dieser Technologie [345] nahmen (Rekombinationszentren mittels Schwermetallen) gelingt es, inhärente "Fast-Recovery-Dioden" im DMOSFET (FREDFET) zu erreichen. Eine dieser komplexen Technologien ist der BiCDMOS-Prozeß.…”

Section: Laterale Leistungsbauelemente Und Smart-power-elementeunclassified

Elektrische Antriebe 3

Schröder¹

1996

Springer-Lehrbuch

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Section: Laterale Leistungsbauelemente Und Smart-power-elementeunclassified

Elektrische Antriebe 3

Schröder¹

1996

Springer-Lehrbuch

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“…[1][2][3][4] They are widely used as switches with a feature of self-protection against shorted loads, over-temperature, and power line disturbance. [5][6][7][8] In the case of automotive application such as in an engine control unit (ECU), the devices operate under a harsh environment. 9,10) Therefore, excellent reliability in hot carrier (HC) degradation and thermal safety operation area (T-SOA) are especially required.…”

Section: Introductionmentioning

confidence: 99%

Reliability study of thermal cycling stress on smart power devices

Zhang

Yoshihisa

Furuya

et al. 2014

Jpn. J. Appl. Phys.

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In this paper, we describe a smart power device degradation behavior under thermal cycling stress. An innovative test structure was developed, which faithfully reflects a stress state caused by the smart power device during operation. From our experiment, the device degraded after millions of fast thermal cycling pulses. We discovered that via destruction was the cause of the device degradation. For the duration of thermal cycling stress, the via resistance increased gradually, and finally increased rapidly at the point of millions of cycles. A failure via was observed, which was broken into two parts. Therefore, the via disconnection was considered to be due to thermo-mechanical stress or electro-migration. Some experiments were conducted, and we demonstrated that the via destruction dominated to the thermo-mechanical stress introduced by the thermal cycling stress.

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Smart-Power-Bauelemente

Leistungselektronische Bauelemente

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A 60 V BiCDMOS device technology for automotive applications

Cited by 6 publications

References 6 publications

Elektrische Antriebe 3

Elektrische Antriebe 3

Reliability study of thermal cycling stress on smart power devices

Smart-Power-Bauelemente

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