A 60-GHz Band Planar Dipole Array Antenna Using 3-D SiP Structure in Small Wireless Terminals for Beamforming Applications

Yoshida, Shizuo; Suzuki, Yôiti; Ta, Tuan Thanh; Kameda, Suguru; Suematsu, Noriharu; Takagi, Tadashi; Tsubouchi, Kazuo

doi:10.1109/tap.2013.2257643

Cited by 31 publications

(9 citation statements)

References 12 publications

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“…Radio frequency (RF) circuits have the characteristics of high frequency and high power consumption, thus the reliability and miniaturization of RF systems are facing great challenges [1,2,3,4,5]. System in Package (SiP) technology, especially 3D SiP, can realize threedimensional packaging, which has a higher density than traditional planar packaging, and is more suitable for system miniaturization [6,7,8,9]. The main implementations of SiP are through ceramic substrate, organic substrate and silicon substrate dividing by substrate material.…”

Section: Introductionmentioning

confidence: 99%

Design of a Ka-band receiver front end using Si-based system in package

Zhu

Jun

Wang

et al. 2021

IEICE Electron. Express

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This letter presents a Ka-band receiver front end in the form of system in package using silicon substrate. The front end adopts a dualchannel superheterodyne structure, two GaAs downconverter chips and a power divider chip are integrated on the silicon substrate with an embedded substrate integrated waveguide bandpass filter. Wire-bonding is used for connections and unique impedance matching structure is designed and embedded into the GSG transmission line to compensate for additional insertion loss. The test results show a conversion gain of -13.4 dB without the gain of low noise amplifier. The work in this letter is one of few presentation of a RF system in the form of stacked silicon system in package, revealing the feasibility of stacked silicon in complex RF system implement.

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Section: Introductionmentioning

confidence: 99%

Design of a Ka-band receiver front end using Si-based system in package

Zhu

Jun

Wang

et al. 2021

IEICE Electron. Express

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“…4 These antennas are generally effectuated by employing the phase shifters to control the phase of the signal through multiple antennas. [5][6][7] In this context, large footprint size and high cost are usually occupied, in addition to extra severe loss caused by the phase shifters. As reported in References 8,9, pattern reconfigurability is another promising technique to achieve the multibeam radiation pattern.…”

Section: Introductionmentioning

confidence: 99%

A folded higher‐mode slot antenna with enhanced bandwidth and radiation pattern reshaping

Liu

2021

Int J RF Microw Comput Aided Eng

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In this article, an approach to reshape the radiation pattern of the 1.5λ-mode of the slot antenna is proposed. Unlike previous works on slot antenna operating at the fundamental mode with a broadside radiation performance, the proposed slot antenna holds four symmetric radiation beams by resonating at its radiative λand 1.5λ-mode. Initially, by folding the straight slot radiator at one short-ended terminal, radiation patterns in H-plane of the 1.5λ-mode could be significantly reshaped from the broadside beam into four symmetric radiation beams, while that of the λ-mode almost remains unchanged. Then, a pair of slot stubs is symmetrically introduced to further improve the bandwidth of multibeam radiation performance. An antenna prototype is finally fabricated and measured to validate the predicted performance. Good agreement between the simulated and measured results is observed. The antenna operates in a frequency range of 3.64 to 3.96 GHz with S 11 lower than À 10 dB under dualmode resonance. And four symmetric beams for radiation have been successfully obtained at the directions of 40 , À 40 , 140, and À 140 with respect to the broadside direction across the whole operating bandwidth.

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“…Nevertheless, it was easier to handle the copper ball (than the copper pillar) because the direction or angle was no longer required for such. Reference [45] utilized the interconnection with copper balls as a feed line for a dipole array antenna at 60 GHz. As with a copper balls' interconnection [44], the quasi-coaxial transmission line [46] was designed, whereas an oval shape ground via was designed for the LTCC substrate [47].…”

Section: Introductionmentioning

confidence: 99%

“…Actually, previous works utilizing copper balls for 3-D packaging [42], [43] reported MMW transmission characteristics [44]. Here, the transmission line was used as a feed line of a 60-GHz-band array antenna [45], and the copper balls were simply mounted onto the flat surface in a conventional structure [44]. Although a donut shape solder resist was used as a self-alignment effect in reflow process was initially expected, the fabrication results showed inevitable fluctuations in the transmission characteristics.…”

Section: Introductionmentioning

confidence: 99%

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

Yoshida

Nishikawa

2020

IEEE Access

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This paper presents a vertical transition of millimeter-wave signal for interconnection between multi-layered substrates, which utilizes copper balls for vertical interconnection, as both for electrical connection and physical support. In particular, the copper balls were used to configure a quasi-coaxial transmission line at the vertical interconnection. The key idea was to create an excavated structure at the location of the copper balls to fix it, given that the copper balls slightly fluctuate during reflow soldering when simply placed on a flat surface. Such activity of the copper balls defines large variation in transmission characteristics at millimeter-wave band that produce low yield rate. Practically, with the proposed method of an excavated structure, the location error of the copper balls can be minimized, leading to high reproducibility in determining the copper balls location, and small variation of the transmission characteristics. To verify the method's effectiveness, a prototype having three vertically stacked multi-layered substrates with the excavated structure was fabricated. The excavation had a depth of 90 µm and diameter of 0.45 mm. The copper balls used had a 0.3-mm diameter. Five samples were fabricated and then evaluated by X-ray images and S-parameter measurements. Based on the results, the reflection characteristics of the measurement were less than −10 dB from dc to 97 GHz in the best-case scenario, whereas the variation in the S-parameters was comparatively small up to 70 GHz. Moreover, the X-ray images showed relatively small copper balls location error. These results indicate that the proposed excavated structure is effective for millimeter-wave vertical interconnections using copper balls, in small wireless terminal applications.

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A 60-GHz Band Planar Dipole Array Antenna Using 3-D SiP Structure in Small Wireless Terminals for Beamforming Applications

Cited by 31 publications

References 12 publications

Design of a Ka-band receiver front end using Si-based system in package

Design of a Ka-band receiver front end using Si-based system in package

A folded higher‐mode slot antenna with enhanced bandwidth and radiation pattern reshaping

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

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