A 2D Waveguide Method for Lithography Simulation of Thick SU-8 Photoresist

Geng, Zi-Chen; Zhou, Zai-Fa; Dai, Hui; Huang, Qing‐An

doi:10.3390/mi11110972

Cited by 3 publications

(3 citation statements)

References 28 publications

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“…Zhou et al [ 14 ] proposed a comprehensive aerial image model using Fresnel diffraction to calculate the three-dimensional (3D) inclined/vertical UV light intensity distribution in SU-8. Meanwhile, Geng et al [ 15 ] constructed a high precision photolithography simulation of the thick SU-8 photoresist using the waveguide method (WG) in two dimensions and predicted the profiles of the photoresist based on the calculated light intensity distribution in SU-8. Koyama et al [ 16 ] simulated the UV curing process of the photoresist via nanoimprint photolithography utilizing the molecular mechanics method.…”

Section: Introductionmentioning

confidence: 99%

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Sun

Liang

et al. 2023

Micromachines

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Due to the widespread application of flexible printed circuit boards (FPCBs), attention is increasing being paid to photolithography simulation with the continuous development of ultraviolet (UV) photolithography manufacturing. This study investigates the exposure process of an FPCB with an 18 µm line pitch. Using the finite difference time domain method, the light intensity distribution was calculated to predict the profiles of the developed photoresist. Moreover, the parameters of incident light intensity, air gap, and types of media that significantly influence the profile quality were studied. Using the process parameters obtained by photolithography simulation, FPCB samples with an 18 µm line pitch were successfully prepared. The results show that a higher incident light intensity and a smaller air gap result in a larger photoresisst profile. Better profile quality was obtained when water was used as the medium. The reliability of the simulation model was validated by comparing the profiles of the developed photoresist via four experimental samples.

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Section: Introductionmentioning

confidence: 99%

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Sun

Liang

et al. 2023

Micromachines

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“…The papers that are published in this Special Issue explore the following micro- and nano-manufacturing processes: laser texturing [ 1 , 2 ], 3D printing [ 3 , 4 ], grinding [ 5 , 6 ], turning [ 7 , 8 ], and electrochemical machining [ 9 , 10 ]. The remaining papers cover lithography-based manufacturing [ 11 ], and micro- and nano-scale design aspects [ 12 ].…”

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confidence: 99%

“…A lithography process involves transferring a geometric pattern from a mask to a photoresist-coated semiconductor wafer surface. Geng et al used a high-precision lithography simulation model for thick SU-8 photoresist, based on the waveguide method, to calculate light intensity in the photoresist and predict the profiles of developed SU-8 structures [ 11 ].…”

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confidence: 99%

Editorial for the Special Issue on Advances in Micro and Nano Manufacturing: Process Modeling and Applications

Masato

Lucchetta

2021

Micromachines

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Low-cost fabrication of microlasers based on polymeric micropedestals

et al. 2021

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Our current work exploits direct laser writing (DLW) and low one-photon absorption (LOPA) in a low-cost three-dimensional optical fabrication system designed to print micrometric polymeric structures. Micropedestals were obtained by focusing a laser beam on a photoresist layer deposited on a silica glass substrate. Subsequent coating with rhodamine 6G dye allows these pedestals to function as microlasers upon optical excitation at 532 nm. Our microlasers, with a diameter of ∼ 53 µ m and a height of ∼ 40 µ m , exhibit a broad fluorescence peak in the spectral range 540–600 nm, in addition to narrow lasing peaks, exhibiting quality factors Q exceeding 2000 and a lasing threshold of ∼ 5 µ J c m − 2 . The observed free spectral range associated with the lasing peaks of ∼ 1.3 n m is consistent with simulations, which we include in this paper. In addition, we present simulations for the longitudinal shift of the patterning laser spot, which occurs particularly for relatively thick photoresist layers, coupled with a large index contrast at the photoresist top surface. Such a shift could introduce errors in the resulting microfabricated structures if left unaccounted for. We hope that our work will contribute to the development of microlasers for various photonic applications, particularly if dimensions can be reduced, for on-chip optical communications and data processing.

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A 2D Waveguide Method for Lithography Simulation of Thick SU-8 Photoresist

Cited by 3 publications

References 28 publications

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Editorial for the Special Issue on Advances in Micro and Nano Manufacturing: Process Modeling and Applications

Low-cost fabrication of microlasers based on polymeric micropedestals

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