A “2.5-D” modeling approach for single-phase flow and heat transfer in manifold microchannels

Mandel, Raphael; Shooshtari, Amir; Ohadi, Michael M.

doi:10.1016/j.ijheatmasstransfer.2018.04.145

Cited by 37 publications

(9 citation statements)

References 17 publications

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“…Mandel et al 45 performed a reduced order 2.5-D CFD modeling method for single-phase flow and heat transfer in manifold microchannels. 10,39,46,47 The reduced order has lowered the computational cost in contrast to a full 3-D simulation.…”

Section: Review Of Recent Literature With Results and Discussionmentioning

confidence: 99%

“…Li et al 46 performed numerical simulation to study the thermal performance of non-Newtonian fluid flow 10,23,26,48,49 in manifold microchannel (MMC) 10,39,45–47 heat sink compared with traditional microchannel (TMC) heat sink. Compared with Newtonian fluid flow, pseudo-plastic fluid 10 lowered drag resistance in both MMC and TMC while dilatant fluid led to larger drag resistance.…”

Section: Review Of Recent Literature With Results and Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Fluid flow characteristics and heat transfer performance in microchannel heat sinks: A review

Jan

Butt

Hassan

2022

Proceedings of the Institution of Mechanical Engineers, Part E:

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The hydraulic and thermal characteristics of fluid flow in microchannels have advanced applications for the thermal management of electronic devices. There has been a wide development in the field of research concerning experimental procedures as well as numerical analysis of fluid flow in microchannels over the past decade. This article provides an overview of overall experimental and numerical studies in recent years to obtain clear understanding of various parameters affecting the fluid flow and heat transfer performance in microchannels. Furthermore, the article will come in handy for the researchers and scientists dealing with the basic correlations and some dimensionless parameters governing the hydrodynamic as well as thermic behavior of fluid flow in microchannels. This article underlines the recent studies on nanofluids in this specific area; additionally, it has encapsulated the influence on thermal performance by numerous designs of MCHS such as fins, ribs, etc. The latest research has revealed that there is a little agreement over the literature provided by experimental and theoretical analyses. Eventually, the conclusions drawn from this study and future prospective of research in this area have been thoroughly discussed.

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Section: Review Of Recent Literature With Results and Discussionmentioning

confidence: 99%

Section: Review Of Recent Literature With Results and Discussionmentioning

confidence: 99%

Fluid flow characteristics and heat transfer performance in microchannel heat sinks: A review

Jan

Butt

Hassan

2022

Proceedings of the Institution of Mechanical Engineers, Part E:

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“…Their results found that the cooling capacity of the evaporator increased with the increase of the charging ratio. Mandel et al [25] developed a simplified "2.5D" CFD model for studying the single-phase flow and heat transfer in manifold microchannels. They found that the model had high accuracy when inertia was low enough.…”

Section: Classical Computational Fluid Dynamics (Cfd)mentioning

confidence: 99%

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Gao

Yang

et al. 2022

Thermal Science and Engineering Progress

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“…Thus, it is necessary to study the effective heat rejection apparatus to ensure the safety and reality of electronic at the higher heat flux cases. The microchannel and pulsating heat pipe (PHP) are the most promising approach to remove the heat from the higher heat flux device 3‐5 . Especially, the PHP attracted great attention for the advantages of the passive heat dissipation 6 .…”

Section: Introductionmentioning

confidence: 99%

Effect of ultrasonic on the enhancement of heat transfer for pulsating heat pipe

Zhang

Jiang

et al. 2021

Int J Energy Res

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Summary The pulsating heat pipe (PHP) has become one of the most promising devices to dramatically remove heat for electronic devices. This work focuses on the experimental investigation of ultrasonic on the enhancement of heat transfer of PHP, and further discusses this effect at the different working fluids. The results indicate that the external region of PHP exhibits more intense oscillation motion of working fluids than that of internal‐region. The heat transfer performance enhanced assisted with the ultrasonic at the heating power of 5 to 20 W but deteriorated at 25 W. For details, the heat transfer coefficient (HTC) increased 72.6%, and the internal and external start‐up times reduced 57.8% and 2.2%, respectively. Furthermore, the numerous vapors confirm that the ultrasonic cavitation would effectively accelerate the phase transition. Finally, it also discusses the couple effect between the ultrasonic and different working fluids on heat transfer coefficient. The maximum HTC of 1.85 is obtained at the heating power of 15 W for the PHP charged with acetone. In addition, the trend of HTC of PHP filled with acetone shows much more stable assisted with ultrasonic varying from the heating power inputs. Highlights The thermal performance was revealed by internal and external region of PHP The directly enhanced method of ultrasonic cavitation was introduced The novel index of the heat transfer coefficient (HTC) was proposed The couple effect ultrasonic on the enhancement of heat transfer was discussed with different working fluids

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A “2.5-D” modeling approach for single-phase flow and heat transfer in manifold microchannels

Cited by 37 publications

References 17 publications

Fluid flow characteristics and heat transfer performance in microchannel heat sinks: A review

Fluid flow characteristics and heat transfer performance in microchannel heat sinks: A review

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Effect of ultrasonic on the enhancement of heat transfer for pulsating heat pipe

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