2013
DOI: 10.1007/s11082-013-9774-1
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A 14 Gbps vertical cavity surface emitting lasers with transistor outline package

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(1 citation statement)
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“…In figure 6(a), the parylene/graphene UV photodetector was encapsulated by Transistor Outline (TO) packaging technology. TO packaging has been widely used to package small photodetectors, due to its low cost [50]. GPD was fixed on the base by adhesive tape.…”
Section: Resultsmentioning
confidence: 99%
“…In figure 6(a), the parylene/graphene UV photodetector was encapsulated by Transistor Outline (TO) packaging technology. TO packaging has been widely used to package small photodetectors, due to its low cost [50]. GPD was fixed on the base by adhesive tape.…”
Section: Resultsmentioning
confidence: 99%