A 120-W X-band spatially combined solid-state amplifier

Cheng, Nai-Shuo; Jia, Pengcheng; Rensch, D.B.; York, R.A.

doi:10.1109/22.809006

Cited by 131 publications

(7 citation statements)

References 2 publications

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“…12. Measurements were completed for different pulse duty cycles Compared to other SSPAs using spatial power combining [21][22][23], the proposed approach offers the most compact design with low loss. At Ku-band (using WR62 waveguide, a × b = 15.8 × 7.8 mm 2 ), a limit of two HPAs along with the required capacitors can be placed inside the waveguide without suffering from instability.…”

Section: Implementation and Resultsmentioning

confidence: 99%

Low‐loss compact power combiner for solid state power amplifiers with high reliability

Gholami¹,

Amaya

Yagoub³

2016

IET Microwaves, Antennas & Propagation

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In this study, a low‐loss and compact planar power combiner for solid state power amplifiers (SSPAs) is proposed. It combines eight power amplifier modules with low insertion loss (IL) and high reliability by utilising a novel magic‐Tee configuration and E‐plane bend along with a suitable microstrip‐to‐waveguide transition. The fabricated prototype was implemented through automatic milling machines to produce three planar layers that form the final structure. This novel approach enabled precise fabrication, simple assembly of the SSPAs as well as low‐cost manufacturing in comparison with existing traditional approaches. This process is suitable for SSPAs operating from 4 to 40 GHz. The combined IL of the implemented combiner network is less than 0.6 dB at Ka‐band, 0.5 dB at Ku‐band, and 0.4 dB at X‐band while exhibiting a 10% fractional bandwidth.

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Section: Implementation and Resultsmentioning

confidence: 99%

Low‐loss compact power combiner for solid state power amplifiers with high reliability

Gholami¹,

Amaya

Yagoub³

2016

IET Microwaves, Antennas & Propagation

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“…Table 4 shows the performance comparison of this work with the previous tray-type spatial power combiners operating from X-to Ka-band. The power combiners in [9], [10] stacks several trays (from two to six) using slotline-to-microstrip transition inside X-band standard waveguide without size expansion. In [14] and [19], the K-and Ka-band waveguides were expanded using stepped and tapered waveguides, so that they could contain six and two trays, respectively.…”

Section: Fabrication and Measurementmentioning

confidence: 99%

“…Tray-type power combiners, where many trays with power devices are vertically stacked inside the rectangular waveguide, have been widely adopted for high-power generation in several frequency bands. In [9] and [10], several PA trays were spatially combined within Xband standard waveguide using a tapered slot antenna array. In both papers, bond-wires were used to convert the TE10 mode of the waveguide into the quasi-TEM mode of the microstrip.…”

Section: Introductionmentioning

confidence: 99%

Ka-Band Tray-Type Spatial Power Combiner Using H-Plane Expanded Waveguide With Side-Ridges

Park

Jeong

2023

IEEE Access

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A tray-type spatial power combiner is proposed at Ka-band using an H-plane expanded waveguide with side-ridges and a dipole transition array. In order to overcome the small size of the Ka-band standard waveguide and accommodate as many as trays (six trays in this work), the H-plane of the waveguide is expanded by three times using two-stepped waveguide transition. A circular post is employed to effectively suppress higher-order modes in the expanded waveguide. In addition, a side-ridged waveguide is proposed to reduce non-uniformity in the field and power distribution along the expanded H-plane which seriously degrades power combining efficiency. It boosts the electric field close to the waveguide sidewalls by adding the metallic ridges which reduces the waveguide height at the sides. It is shown from the simulation that the proposed side-ridged waveguide can evenly distribute the electromagnetic power and reduce the magnitude imbalances between the trays. In addition, a capacitive iris is introduced in the ridges to improve the phase balance as well. The H-plane expanded waveguide with side-ridges was fabricated and the measurement showed an insertion loss as low as 0.2 dB at Ka-band. Then, six trays consisting of dipole transition and microstrip line on the dielectric substrate was accommodated between the H-plane expanded waveguides with side-ridges. The overall power combining system exhibited the measured insertion loss of 1.2 dB (backto-back loss) at Ka-band. This result belongs to the excellent performance in terms of insertion loss and the number of the trays among the tray-type spatial power combiners reported at Ka-band.INDEX TERMS Expanded waveguide, millimeter-wave, spatial power combiner, waveguide transitions.

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“…The combining loss as well as the other technical challenges like power handling capability have been  Corresponding Author limiting factors for designers. High power combiners such as radial [1][2][3][4], spatial [5][6][7] and traveling wave [8] power combiners are presented in the literature for different applications. In waveguide radial power combiners [1], the compromise between the bandwidth and combining efficiency is the main subject of the researches and the combining efficiency can be considered as the main advantage of them.…”

Section: Introductionmentioning

confidence: 99%

Mathematical Formulation and Experimental Evaluation of Efficient 8-Way Microwave Radial Power Combiner for High Power Applications

Ahmadi,

Kheirdoost

2023

itrc

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An 8 port narrowband Radial Power Combiner (RPC) with excellent combining efficiency is presented. A novel useful criteria for optimal design of the RPC is developed and the design is studied based on it. Also to provide a reliable, tolerant and cost effective mechanical design, the mechanical structure of the combiner is simplified for fabrication and assembly. The designed RPC has standard waveguide ports at inputs, so it can be used in standard high power applications without any adaptors. The physical structure simplicity guarantees the product reliability for industrial high power applications. The optimized RPC design is fabricated and the measurement results are presented. The back-to-back measurement setup using customized through lines and two identical combiners have helped to take into account other efficiency degrading phenomena like port junctions' discontinuity. It is shown that simulated power combining efficiency of 99% and measured power combining efficiency of 97.7 % is achieved.

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A 120-W X-band spatially combined solid-state amplifier

Cited by 131 publications

References 2 publications

Low‐loss compact power combiner for solid state power amplifiers with high reliability

Low‐loss compact power combiner for solid state power amplifiers with high reliability

Ka-Band Tray-Type Spatial Power Combiner Using H-Plane Expanded Waveguide With Side-Ridges

Mathematical Formulation and Experimental Evaluation of Efficient 8-Way Microwave Radial Power Combiner for High Power Applications

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